微控制器、微处理器、FPGA 模块

制造商 系列 包装 产品状态 模块/板类型 核心处理器 协处理器 速度 闪存大小 RAM 大小 连接器类型 尺寸 / 尺寸 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 模块/板类型 核心处理器 协处理器 速度 闪存大小 RAM 大小 连接器类型 尺寸 / 尺寸 工作温度
TE0728-03-1Q

TE0728-03-1Q

IC MODULE CORTEX-A9 512MB

Trenz Electronic GmbH

0 -
TE0728-03-1Q

数据表

TE0728 Bulk Active MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7020) - 16MB 512MB Samtec SEM 2.360" L x 2.360" W (60.00mm x 60.00mm) -
TE0803-04-3BE11-A

TE0803-04-3BE11-A

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

0 -
TE0803-04-3BE11-A

数据表

TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU3EG-1SFVC784E - - 128MB 2GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0803-01-03CG-1EA

TE0803-01-03CG-1EA

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

0 -
TE0803-01-03CG-1EA

数据表

TE0803 Bulk Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU3CG-1SFVC784E - - 128MB 2GB B2B 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0741-05-A2I-1-A

TE0741-05-A2I-1-A

MODULE FPGA KINTEX

Trenz Electronic GmbH

0 -

-

Kintex™-7 Bulk Active FPGA Xilinx Kintex-7 FPGA XC7K70T-2FBG676I - - 32MB - Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0600-03-83I21-A

TE0600-03-83I21-A

IC MODULE GIGABEE

Trenz Electronic GmbH

0 -
TE0600-03-83I21-A

数据表

- Bulk Not For New Designs FPGA Core Spartan-6 LX-150 - 125MHz 16MB 1GB Samtec LSHM 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0820-05-4AE81MA

TE0820-05-4AE81MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0 -

-

- Bulk Active - - - - - - - - -
TE0600-03-83I11-A

TE0600-03-83I11-A

IC MODULE GIGABEE

Trenz Electronic GmbH

0 -
TE0600-03-83I11-A

数据表

- Bulk Not For New Designs FPGA Core Spartan-6 LX-150 - 125MHz 16MB 256MB Samtec LSHM 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
5CSX-H6-4YA-RC

5CSX-H6-4YA-RC

IC MOD CORTEX-A9 800MHZ 1GB 32MB

Critical Link LLC

0 -
5CSX-H6-4YA-RC

数据表

MitySOM Bulk Active MPU, FPGA Core ARM® Cortex®-A9, Cyclone V SX/SE NEON™ SIMD 800MHz 32MB 1GB Edge Connector 3.200" L x 1.500" W (82.00mm x 39.00mm) 0°C ~ 70°C
TE0813-01-4AE11-A

TE0813-01-4AE11-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0 -

-

Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU4CG-1SFVC784E - - 128MB 2GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0813-02-4AE81-A

TE0813-02-4AE81-A

MPSOC MODULE WITH AMD ZYNQ ULTRA

Trenz Electronic GmbH

0 -

-

Zynq UltraScale+ Bulk Active MPU Core Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
SOMOMAP3530-21-1780AGIR

SOMOMAP3530-21-1780AGIR

IC MOD CORTEX-A8 600MHZ 256MB

Beacon EmbeddedWorks

0 -
SOMOMAP3530-21-1780AGIR

数据表

OMAP35x Bulk Active MPU Core ARM® Cortex®-A8, OMAP3530 - 600MHz 512MB 256MB Board-to-Board (BTB) Socket - 200 0.590" L x 1.060" W (15.00mm x 27.00mm) -40°C ~ 85°C
ME-XU5-2EG-1I-D11E-R1.2

ME-XU5-2EG-1I-D11E-R1.2

SOM ZYNQ US+ ZU2EG 2GB+0.5GB PL

Enclustra FPGA Solutions

0 -
ME-XU5-2EG-1I-D11E-R1.2

数据表

- Box Obsolete MPU, FPGA Core ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU - 600MHz, 1.5GHz 16GB 512MB, 2GB 168 Pin 2.200" L x 2.130" W (56.00mm x 54.00mm) -40°C ~ 85°C
TE0813-01-3BE11-A

TE0813-01-3BE11-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0 -

-

Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU3EG-1SFVC784E - - 128MB 2GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0813-02-3BE81-A

TE0813-02-3BE81-A

MPSOC MODULE WITH AMD ZYNQ ULTRA

Trenz Electronic GmbH

0 -

-

Zynq UltraScale+ Bulk Active MPU Core Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0821-01-3BE21ML

TE0821-01-3BE21ML

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0 -
TE0821-01-3BE21ML

数据表

TE0823 Bulk Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU3EG-1SFVC784E ARM® Cortex®-A53, ARM® Cortex®-R5 - 128MB 2GB 2 x 100 Pin 1.970" L x 1.570" W (50.00mm x 40.00mm) 0°C ~ 85°C
DBRF5110C

DBRF5110C

IC MOD CORTEX-A9 800MHZ 1GB

Dave Embedded Systems

0 -

-

BORA Box Active MPU, FPGA Core ARM® Cortex®-A9, XC7Z020-3 Artix-7 800MHz 1GB (NAND), 32MB (NOR) 1GB 3 x 140 Pins 0.6mm Pitch - 0°C ~ 70°C
TE0820-05-3BE81MA

TE0820-05-3BE81MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0 -

-

- Bulk Active - - - - - - - - -
TE0821-01-3BE21MA

TE0821-01-3BE21MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0 -

-

TE0823 Bulk Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU3EG-1SFVC784E ARM® Cortex®-A53, ARM® Cortex®-R5 - 128MB 2GB 2 x 100 Pin 1.970" L x 1.570" W (50.00mm x 40.00mm) 0°C ~ 85°C
C10G-6T-4XA-RI

C10G-6T-4XA-RI

CYCLONE 10 GX MODULE, 220KLE, 1G

Critical Link LLC

0 -
C10G-6T-4XA-RI

数据表

MitySOM Bulk Active FPGA Core - - 100MHz 32MB 1GB Board to Board (BTB) Socket, Card Edge 2.750" L x 2.400" W (69.85mm x 60.96mm) -40°C ~ 85°C
AM0010-02-4AE21MA

AM0010-02-4AE21MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0 -

-

Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ ZU4CG-1E - - 128MB 4GB Board-to-Board (BTB) Socket 2.205" L x 1.575" W (56.00mm x 40.00mm) 0°C ~ 85°C
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