微控制器、微处理器、FPGA 模块

制造商 系列 包装 产品状态 模块/板类型 核心处理器 协处理器 速度 闪存大小 RAM 大小 连接器类型 尺寸 / 尺寸 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 模块/板类型 核心处理器 协处理器 速度 闪存大小 RAM 大小 连接器类型 尺寸 / 尺寸 工作温度
TE0783-02-92I33MA

TE0783-02-92I33MA

HIGH-PERFORMANCE SOM WITH XILINX

Trenz Electronic GmbH

0 -

-

TE0782 Bulk Active MPU Core Zynq™ 7000 XC7Z045-2FFG900I ARM Cortex-A9 - 32MB 1GB Board-to-Board (BTB) Socket 3.350" L x 3.350" W (85.00mm x 85.00mm) -40°C ~ 85°C
TE0782-02-92I33MA

TE0782-02-92I33MA

IC MODULE CORTEX

Trenz Electronic GmbH

0 -
TE0782-02-92I33MA

数据表

TE0782 Bulk Active MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7045) - 32MB 1GB Board-to-Board (BTB) Socket 3.350" L x 3.350" W (85.00mm x 85.00mm) -40°C ~ 85°C
TE0807-03-7AI21-A

TE0807-03-7AI21-A

MPSOC ZYNQ USCALE 4GB DDR4

Trenz Electronic GmbH

0 -
TE0807-03-7AI21-A

数据表

TE0807 Box Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU7CG-1FBVB900I - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
TE0817-01-7DI21-A

TE0817-01-7DI21-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0 -

-

Zynq® UltraScale+™ Bulk Obsolete MPU Core Zynq UltraScale+ XCZU7EV-1FBVB900I - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
TE0807-03-7DI21-AZ

TE0807-03-7DI21-AZ

MPSOC MODULE WITH AMD ZYNQ ULTRA

Trenz Electronic GmbH

0 -

-

Zynq UltraScale+ Bulk Obsolete MPU Core Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900I - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 160 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
DC-VA-H264-10B-60-4K-OPVIC-0000

DC-VA-H264-10B-60-4K-OPVIC-0000

DECODER H264 4K VID/AUD 10BIT

System-On-Chip (SOC) Technologies Inc.

0 -
DC-VA-H264-10B-60-4K-OPVIC-0000

数据表

* Box Active - - - - - - - - -
EC-VA-H265-10B-60-1080-OPVIC-0000

EC-VA-H265-10B-60-1080-OPVIC-0000

ENCODER H265 HD VID/AUD 10BIT

System-On-Chip (SOC) Technologies Inc.

0 -
EC-VA-H265-10B-60-1080-OPVIC-0000

数据表

- Box Active - - - - - - - - -
EC-VA-H264-10B-60-4K-OPVIC-0000

EC-VA-H264-10B-60-4K-OPVIC-0000

ENCODER H264 4K VID/AUD 10BIT

System-On-Chip (SOC) Technologies Inc.

0 -
EC-VA-H264-10B-60-4K-OPVIC-0000

数据表

- Box Active - - - - - - - - -
A5EB-B9-C7F-RC-SBC

A5EB-B9-C7F-RC-SBC

AGILEX 5E SINGLE BOARD COMPUTER,

Critical Link LLC

0 -
A5EB-B9-C7F-RC-SBC

数据表

- Bulk Active MPU Core ARM® Cortex®-A55, ARM® Cortex®-A76 - 1.8GHz 64GB eMMC, 32MB QSPI 8GB RJ45 8.500" L x 6.000" W (215.90mm x 152.40mm) 0°C ~ 70°C
A5EB-B9-C7F-RC-SBC-X

A5EB-B9-C7F-RC-SBC-X

AGILEX 5E SINGLE BOARD COMPUTER

Critical Link LLC

0 -
A5EB-B9-C7F-RC-SBC-X

数据表

- Bulk Active MPU Core ARM® Cortex®-A55, ARM® Cortex®-A76 - 1.8GHz 64GB eMMC, 32MB QSPI 8GB RJ45 8.500" L x 6.000" W (215.90mm x 152.40mm) 0°C ~ 70°C
EC-VA-H265-10B-60-4K-OPVIC-0000

EC-VA-H265-10B-60-4K-OPVIC-0000

ENCODER H265 4K VID/AUD 10BIT

System-On-Chip (SOC) Technologies Inc.

0 -
EC-VA-H265-10B-60-4K-OPVIC-0000

数据表

* Box Active - - - - - - - - -
TEC0850-03-BBEX1-A

TEC0850-03-BBEX1-A

IC MODULE

Trenz Electronic GmbH

0 -

-

* Bulk Active - - - - - - - - -
TE0865-02-ABI21MA

TE0865-02-ABI21MA

MPSOC MODULE WITH ZYNQ ULTRASCAL

Trenz Electronic GmbH

0 -

-

Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ XCZU11EG-1FFVC1760I - - 256MB 4GB Board-to-Board (BTB) Socket 3.937" L x 2.953" W (100.00mm x 75.00mm) 0°C ~ 85°C
CC-9C-V223-RJ-25

CC-9C-V223-RJ-25

IC MODULE ARM926EJ-S 155MHZ

Digi

0 -

-

ConnectCore® Bulk Obsolete MPU Core ARM926EJ-S, NS9360 - 155MHz - - SO-DIMM-144 2.060" L x 3.590" W (52.20mm x 91.20mm) -40°C ~ 85°C
TE0865-02-FBE23MA

TE0865-02-FBE23MA

MPSOC MODULE WITH ZYNQ ULTRASCAL

Trenz Electronic GmbH

0 -

-

Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E - - 256MB 4GB Board-to-Board (BTB) Socket 3.937" L x 2.953" W (100.00mm x 75.00mm) 0°C ~ 85°C
ME-XU7-15EG-2I-D12E-R5.0

ME-XU7-15EG-2I-D12E-R5.0

SOM ZYNQ XU7 US+ ZU15EG

Enclustra FPGA Solutions

0 -
ME-XU7-15EG-2I-D12E-R5.0

数据表

Mercury+ XU7 Bulk Active MPU Core ARM® Cortex®-A53, ARM® Cortex®-R5 Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I - 16GB 2GB 168 Pin 2.910" L x 2.130" W (74.00mm x 54.00mm) -40°C ~ 85°C
TE0865-02-DGE23MA

TE0865-02-DGE23MA

MPSOC MODULE WITH ZYNQ ULTRASCAL

Trenz Electronic GmbH

0 -

-

Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ XCZU17EG-2FFVC1760E - - 256MB 4GB Board-to-Board (BTB) Socket 3.937" L x 2.953" W (100.00mm x 75.00mm) 0°C ~ 85°C
TE0835-02-MXE21-A

TE0835-02-MXE21-A

RFSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0 -

-

Zynq® UltraScale+™ Bulk Obsolete MPU Core Zynq™ UltraScale+™ XCZU25DR-1FFVE1156E ARM® Cortex®-A53, ARM® Cortex®-R5 1.3GHz 128MB 4GB Board-to-Board (BTB) Socket 3.543" L x 2.559" W (90.00mm x 65.00mm) 0°C ~ 85°C
IW-G35M-19EG-4E004G-E008G-BEF

IW-G35M-19EG-4E004G-E008G-BEF

ZU19EG (-3 SPEED) MPSOC SOM

iWave Global

1 -
IW-G35M-19EG-4E004G-E008G-BEF

数据表

- Bulk Active - - - - - - - - -
TE0835-02-TXE21-A

TE0835-02-TXE21-A

RFSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

0 -

-

Zynq® UltraScale+™ Bulk Obsolete MPU Core Zynq™ UltraScale+™ XCZU47DR-1FFVE1156E ARM® Cortex®-A53 1.3GHz 512MB 4GB Board-to-Board (BTB) Socket 3.543" L x 2.559" W (90.00mm x 65.00mm) 0°C ~ 85°C
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