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调制解调器 - 集成电路（IC）和模块

制造商	系列	封装/外壳	包装	产品状态	数据格式	波特率	电压 - 电源	安装类型	供应商设备封装
Analog Devices Inc. Analog Devices Inc./Maxim Integrated CML Micro Conexant Copeland Communications Inc. Cypress Semiconductor Corp Freescale Semiconductor - NXP Harris Corporation Infineon Technologies Intel IXYS Integrated Circuits Division Lantiq MaxLinear, Inc. Microchip Technology Motorola NXP Semiconductors onsemi Rochester Electronics, LLC Semtech Corporation Silicon Labs Skyworks Solutions Inc. SMSC STMicroelectronics Texas Instruments Wintec Industries Yamar Zarlink Zilog	* - 89024 AD1801 CY8CPLC10 ISOcap™ ISOmodem® ISOmodem™ SL SLM	- 100-TQFP 120-LQFP 128-BFQFP 128-LQFP 128-QFP 16-DIP (0.300", 7.62mm) 16-SOIC (0.154", 3.90mm Width) 16-SOIC (0.295", 7.50mm Width) 16-TSSOP (0.173", 4.40mm Width) 16-VFQFN Exposed Pad 20-SOIC (0.295", 7.50mm Width) 20-TSSOP (0.173", 4.40mm Width) 22-DIP (0.400", 10.16mm) 24-SOIC (0.295", 7.50mm Width) 24-SSOP (0.209", 5.30mm Width) 24-TSSOP (0.173", 4.40mm Width) 24-VFQFN Exposed Pad 24-WFQFN Exposed Pad, CSP 28-DIP (0.600", 15.24mm) 28-LCC (J-Lead) 28-SOIC (0.295", 7.50mm Width) 28-SSOP (0.209", 5.30mm Width) 28-VFCLGA 28-VFQFN Exposed Pad 32-LCC (J-Lead) 32-LQFP 32-TQFP 32-VFQFN Exposed Pad 38-VFQFN Exposed Pad 40-DIP Module 44-LCC (J-Lead) 44-LQFP 48-LQFP 48-VFQFN Exposed Pad 52-VFQFN Exposed Pad 56-VFQFN Exposed Pad 64-LQFP 64-VFQFN Exposed Pad 68-LCC (J-Lead) 8-SOIC (0.154", 3.90mm Width) Exposed Pad Module	Box Bulk Cut Tape (CT) Strip Tape & Reel (TR) Tray Tube	Active Discontinued at Digi-Key Last Time Buy Not For New Designs Obsolete	- ASK ASK over Home Power Lines FSK FSK, Bell 202 FSK, V.21, V.22, Bell 103, Bell 212A FSK, V.21, V.22, V.23, Bell 103, Bell 212A FSK, V.23 HART PSK V.21, V.22, Bell 103, Bell 212A V.21, V.22, V.22B, V.23, V.32, V.32B, V.34, V.90, Bell 103, Bell 212 V.21, V.22, V.23, Bell 103, Bell 202, FSK V.21, V.22, V.23, Bell 103, Bell 212A V.21, V.22, V.23, V.29, Bell 103, Bell 212A V.21, V.22, V.23, V.29, V.32, Bell 103, Bell 212A V.21, V.22, V.23, V.29, V.32, V.34, Bell 103, Bell 212A V.21, V.22, V.23, V.29, V.32, V.34, V.90, V.92, Bell 103, Bell 212A V.21, V.22, V.23, V.32, Bell 103, Bell 202, FSK V.21, V.22, V.23, V.32, V.34, V.90, Bell 103, Bell 212A V.21, V.23, Bell 103, Bell 202, FSK V.22 V.22, V.23 V.22, V23, V.32, V.34, V.90, Bell 103, Bell 212A V.22, V23, V.32, V.34, V.90, V.92, Bell 103, Bell 212A V.32 V.32, V.34, V.90 V.32, V.34, V.90, V.92 V.34 V.34, V.92 V.90 V.92	- 1.2k 1.2k, 1.8k 1.8k 14.4k 19.2k 2.4k 200k 20k 225k ~ 1.4M 300 ~ 9.6k 33.6k 38.4k 4.8k 56k 83.3k ~ 1M 9.6k 9.6k ~ 115.2k Selectable	- 1.42V ~ 1.65V 1.71V ~ 5.5V 1.7V ~ 1.9V, 3V ~ 3.6V 1.8V ~ 3.5V 12V 2.7V ~ 3.6V 2.7V ~ 5.5V 3.3V 3.3V ~ 5V 3.3V, 5V 3V ~ 12V 3V ~ 3.6V 3V ~ 5.25V 3V ~ 5.5V 3V ~ 5V 4.5V ~ 5.5V 4.75V ~ 5.25V 4V ~ 5.5V 5V	- Socket Surface Mount Through Hole	- 100-LQFP 100-TQFP 120-LQFP (14x14) 128-LFQFP 128-LQFP (20x14) 128-MQFP (14x20) 128-TQFP (14x20) 16-PDIP 16-SO 16-SOIC 16-TSSOP 16-VQFN (3x3) 18-DIP 20-SOIC 20-TSSOP 22-PDIP 24-LFCSP-WQ (4x4) 24-QFN (4x4) 24-SOIC 24-SSOP 24-TSSOP 28-CTLGA (11x6.4) 28-PDIP 28-PLCC (11.51x11.51) 28-QFN (6x6) 28-SOIC 28-SOP 28-SSOP 32-LQFP (7x7) 32-PLCC (14x11.46) 32-QFN (5x5) 32-TQFP 32-TQFP (7x7) 38-QFN (5x7) 44-LQFP (10x10) 44-PLCC 48-LQFP (7x7) 48-QFN (7x7) 48-VQFN (7x7) 52-QFN (8x8) 56-QFN (8x8) 64-LQFP (10x10) 64-VQFN (9x9) 68-PLCC 8-SOIC-EP Module

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厂商型号	可用性	价格	数量	数据表	系列	封装/外壳	包装	产品状态	数据格式	波特率	电压 - 电源	安装类型	供应商设备封装
CMX7364Q1 MULTI-MODE HIGH PERFOMANCE MODEM CML Micro	499	-	请求报价	数据表	-	64-VFQFN Exposed Pad	Tray	Active	FSK	Selectable	1.7V ~ 1.9V, 3V ~ 3.6V	Surface Mount	64-VQFN (9x9)
CMX7143L4-TR1K MULTI-MODE WIRELSS DATA MODEM CML Micro	699	-	请求报价	数据表	-	48-LQFP	Tape & Reel (TR)	Active	FSK	20k	3V ~ 3.6V	Surface Mount	48-LQFP (7x7)
73M2901CE-IGVR/F IC MODEM 3.3V V.22BIS 32-TQFP Analog Devices Inc./Maxim Integrated	2,000	-	请求报价	数据表	-	32-TQFP	Tape & Reel (TR)	Not For New Designs	V.21, V.22, V.23, Bell 103, Bell 212A	300 ~ 9.6k	2.7V ~ 3.6V	Surface Mount	32-TQFP (7x7)
CY8CPLC20-48LTXI IC PLC PSOC CMOS 48QFN Infineon Technologies	1,140	-	请求报价	数据表	-	48-VFQFN Exposed Pad	Tray	Active	FSK	2.4k	4.75V ~ 5.25V	Surface Mount	48-QFN (7x7)
MT8840AE ZARLINK MODEM 2KBPS DATA PDIP18 Zarlink	682	-	请求报价	数据表	-	-	Bulk	Obsolete	ASK	-	5V	Through Hole	18-DIP
PMB9610WV1.0FL COSICULC: DECT BASE STATION Lantiq	5,173	-	请求报价	数据表	*	-	Bulk	Active	-	-	-	-	-
PEF7071VV1.4 XWAY PHY11G, 10/100/1000 MBPS ET Lantiq	177	-	请求报价	数据表	*	-	Bulk	Active	-	-	-	-	-
PEF7072HLV1.3 XWAY PHY11G, 10/100/1000 MBPS E Lantiq	3,739	-	请求报价	数据表	*	-	Bulk	Active	-	-	-	-	-
PMB9647VV2.0 COSIC MODEM KDECT Lantiq	100,129	-	请求报价	数据表	*	-	Bulk	Active	-	-	-	-	-
PSB8304VV1.1 XWAY WAV300 WI-FI CHIPSET Lantiq	430	-	请求报价	数据表	*	-	Bulk	Active	-	-	-	-	-
CX81801-33 CONEXANT VIDEO AMP 1 CHANNEL Conexant	1,440	-	请求报价	数据表	-	128-QFP	Bulk	Obsolete	V.21, V.22, V.22B, V.23, V.32, V.32B, V.34, V.90, Bell 103, Bell 212	-	3.3V	Surface Mount	128-LFQFP
PMB9603VV1.1FL COSICPLUS -MODEM DECT/ CAT-IQ Lantiq	1,358	-	请求报价	数据表	*	-	Bulk	Active	-	-	-	-	-
CX81801-64 MODEM, CMOS, PDSO28 Conexant	26,118	-	请求报价	数据表	-	28-VFCLGA	Bulk	Active	V.32, V.34, V.90	56k	3V ~ 3.6V	Surface Mount	28-CTLGA (11x6.4)
CX81801-63 MODEM, CMOS, PDSO28 Conexant	1,613	-	请求报价	数据表	-	28-VFCLGA	Bulk	Active	V.32	56k	3V ~ 3.6V	Surface Mount	28-CTLGA (11x6.4)
PSB8305VV1.1 XWAY WAV300 WI-FI CHIPSET Lantiq	2,792	-	请求报价	数据表	*	-	Bulk	Active	-	-	-	-	-
AD1801JS SINGLE-CHIP FAX/DATA/VOICE MODEM Analog Devices Inc.	8,559	-	请求报价	数据表	AD1801	128-BFQFP	Bulk	Active	V.34	-	4.75V ~ 5.25V	Surface Mount	128-MQFP (14x20)
AD1801JST-REEL SINGLE-CHIP FAX/DATA/VOICE MODEM Analog Devices Inc.	157	-	请求报价	数据表	AD1801	128-LQFP	Bulk	Active	V.34	-	4.75V ~ 5.25V	Surface Mount	128-TQFP (14x20)
USR80-12 CONEXANT USR80 K56 HCF MODEM IC Conexant	1,738	-	请求报价	数据表	*	-	Bulk	Active	-	-	-	-	-
PPC34C60QFP PARALLEL PORT INTERFACE CHIP SMSC	429	-	请求报价	数据表	*	-	Bulk	Active	-	-	-	-	-
PMB9643VV2.0 COSIC -MODEM DECT/ CAT-IQ Lantiq	1,223	-	请求报价	数据表	*	-	Bulk	Active	-	-	-	-	-

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