电源管理 - 专用

电源管理 - 专用

专用电源管理 IC 是面向特定系统,特定负载或特定应用场景设计的电源管理芯片,常用于处理器供电,系统电源控制,负载管理,电源排序,电源保护,电池供电设备,通信模块,汽车电子,工业控制和嵌入式系统等电路中.该类器件可根据应用需求实现稳压控制,电压监控,电流限制,故障保护,低功耗管理和多通道供电管理等功能.

宝利科技作为专业电子元器件分销商,可为客户供应行业主流厂商的多系列专用电源管理 IC 产品,包括德州仪器(Texas Instruments),亚德诺(Analog Devices),意法半导体(STMicroelectronics),安森美(onsemi),英飞凌(Infineon),微芯科技(Microchip),瑞萨(Renesas),恩智浦(NXP),芯源系统(MPS),美信(Maxim Integrated)等品牌.您可在下方产品列表中查询所需专用电源管理芯片型号的库存,价格,封装规格,品牌,参数及 PDF 规格书等相关资料,并提交 BOM 或型号清单进行批量询价.

制造商 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装

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图片 厂商型号 可用性 价格 数量 数据表 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
LTC3589EUJ#TRPBF

LTC3589EUJ#TRPBF

IC DC/DC CONV 8-OUTPUT 40QFN

Analog Devices Inc.

0 -
LTC3589EUJ#TRPBF

数据表

- 40-WFQFN Exposed Pad Tape & Reel (TR) Active Handheld/Mobile Devices, OMAP™ 8µA 2.7V ~ 5.5V -40°C ~ 125°C - - Surface Mount 40-QFN (6x6)
LTC3589EUJ-1#TRPBF

LTC3589EUJ-1#TRPBF

IC CONV DC/DC 8-OUTPUT 40QFN

Analog Devices Inc.

0 -
LTC3589EUJ-1#TRPBF

数据表

- 40-WFQFN Exposed Pad Tape & Reel (TR) Active Handheld/Mobile Devices, OMAP™ 8µA 2.7V ~ 5.5V -40°C ~ 125°C - - Surface Mount 40-QFN (6x6)
TWL6032A1B0YFFR

TWL6032A1B0YFFR

IC POWER/BATT MGMT 155DSBGA

Texas Instruments

0 -
TWL6032A1B0YFFR

数据表

- 155-UFBGA, DSBGA Tape & Reel (TR) Obsolete Handheld/Mobile Devices, OMAP™ 20µA 2.5V ~ 4.8V -40°C ~ 85°C - - Surface Mount 155-DSBGA (5.21x5.36)
MC35FS4503CAER2

MC35FS4503CAER2

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

0 -
MC35FS4503CAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MAX20345IEWN+T

MAX20345IEWN+T

WEARABLE POWER MANAGEMENT SOLUTI

Analog Devices Inc./Maxim Integrated

0 -
MAX20345IEWN+T

数据表

- 56-WFBGA, WLBGA Tape & Reel (TR) Active Battery Management 720µA 1V ~ 5.5V, 1.71V ~ 5.5V, 2.7V ~ 5.5V -40°C ~ 85°C (TA) - - Surface Mount 56-WLP (3.37x3.05)
MAX20345JEWN+T

MAX20345JEWN+T

WEARABLE POWER MANAGEMENT SOLUTI

Analog Devices Inc./Maxim Integrated

0 -
MAX20345JEWN+T

数据表

- 56-WFBGA, WLBGA Tape & Reel (TR) Active Battery Management 720µA 1V ~ 5.5V, 1.71V ~ 5.5V, 2.7V ~ 5.5V -40°C ~ 85°C (TA) - - Surface Mount 56-WLP (3.37x3.05)
MWCT2013AVLH

MWCT2013AVLH

NEVIS3A_WCT,64LQFP

NXP USA Inc.

0 -
MWCT2013AVLH

数据表

- 64-LQFP Tray Active Wireless Power Transmitter - - - - - Surface Mount 64-LQFP (10x10)
MC35FS6503CAER2

MC35FS6503CAER2

FS6500

NXP USA Inc.

0 -
MC35FS6503CAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MAX20069BGTLA/V+

MAX20069BGTLA/V+

AUTOMOTIVE I2C-CONTROLLED 4-CHAN

Analog Devices Inc./Maxim Integrated

0 -
MAX20069BGTLA/V+

数据表

- 40-WFQFN Exposed Pad Tube Active TFT-LCD Panels: Gamma Buffer, VCOM Driver 2.2mA 2.8V ~ 5.5V, 4.5V ~ 42V -40°C ~ 105°C (TA) - - Surface Mount 40-TQFN (6x6)
MAX5043ETN+T

MAX5043ETN+T

IC PWR W/MOSFET HS 56-TQFN

Analog Devices Inc./Maxim Integrated

0 -

-

- 56-WFQFN Exposed Pad Tape & Reel (TR) Obsolete General Purpose 20mA 20V ~ 76V -40°C ~ 85°C - - Surface Mount 56-TQFN (8x8)
MC33FS6600M0ESR2

MC33FS6600M0ESR2

SAFETY SBC FOR S32S2 MCU

NXP USA Inc.

0 -

-

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active Safety - 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS6600M1ESR2

MC33FS6600M1ESR2

SAFETY SBC FOR S32S2 MCU

NXP USA Inc.

0 -

-

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active Safety - 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS6600M2ESR2

MC33FS6600M2ESR2

SAFETY SBC FOR S32S2 MCU

NXP USA Inc.

0 -

-

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active Safety - 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200CXES

MC33PF8200CXES

IC POWER MANAGEMENT LS1043A

NXP USA Inc.

0 -
MC33PF8200CXES

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200D2ES

MC33PF8200D2ES

IC POWER MANAGEMENT

NXP USA Inc.

0 -
MC33PF8200D2ES

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DBES

MC33PF8200DBES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

0 -
MC33PF8200DBES

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DFES

MC33PF8200DFES

I.MX8QXP WITH DDR3L

NXP USA Inc.

0 -
MC33PF8200DFES

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DHES

MC33PF8200DHES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

0 -
MC33PF8200DHES

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200ESES

MC33PF8200ESES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

0 -
MC33PF8200ESES

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.7V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200ETES

MC33PF8200ETES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

0 -
MC33PF8200ETES

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.7V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
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