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制造商 系列 包装 产品状态 连接器类型 触点类型 配对间距 位置数量 行数 行间距 - 配对 已加载位置数 样式 遮蔽 安装类型 端接方式 固定类型 触点长度 - 配对部分 触点长度 - 引脚部分 触点总长度 绝缘高度 触点形状 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点表面处理 - 引脚 触点材料 绝缘材料 特性 工作温度 电流额定值(安培)

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 配对间距 位置数量 行数 行间距 - 配对 已加载位置数 样式 遮蔽 安装类型 端接方式 固定类型 触点长度 - 配对部分 触点长度 - 引脚部分 触点总长度 绝缘高度 触点形状 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点表面处理 - 引脚 触点材料 绝缘材料 特性 工作温度 电流额定值(安培)
HTSW-104-20-L-S

HTSW-104-20-L-S

CONN HEADER VERT 4POS 2.54MM

Samtec Inc.

0 -
HTSW-104-20-L-S

数据表

HTSW Bulk Active - - - - - - - - - - - - - - - - - - - - - - -
HTSW-103-08-SM-S-RA

HTSW-103-08-SM-S-RA

CONN HEADER R/A 3POS 2.54MM

Samtec Inc.

0 -

-

HTSW Bulk Active Header Male Pin 0.100" (2.54mm) 3 1 - All Board to Board or Cable Unshrouded Through Hole, Right Angle Solder Push-Pull 0.230" (5.84mm) 0.090" (2.29mm) - 0.122" (3.10mm) Square Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - Varies by Wire Gauge
TSW-107-26-T-S

TSW-107-26-T-S

CONN HEADER VERT 7POS 2.54MM

Samtec Inc.

0 -

-

TSW Bulk Active Header Male Pin 0.100" (2.54mm) 7 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.230" (5.84mm) 0.126" (3.20mm) 0.456" (11.58mm) 0.100" (2.54mm) Square Tin Tin Phosphor Bronze Polybutylene Terephthalate (PBT) - -
TSW-108-14-T-S-LL

TSW-108-14-T-S-LL

CONN HEADER VERT 8POS 2.54MM

Samtec Inc.

0 -

-

TSW Bulk Active Header Male Pin 0.100" (2.54mm) 8 1 - All Board to Board or Cable Unshrouded Through Hole Kinked Pin, Solder Push-Pull 0.320" (8.13mm) 0.110" (2.79mm) 0.530" (13.46mm) 0.100" (2.54mm) Square Tin Tin Phosphor Bronze Polybutylene Terephthalate (PBT) - -
HTSW-106-20-T-S

HTSW-106-20-T-S

CONN HEADER VERT 6POS 2.54MM

Samtec Inc.

0 -
HTSW-106-20-T-S

数据表

HTSW Bulk Active - - - - - - - - - - - - - - - - - - - - - - -
HTSW-106-21-T-S

HTSW-106-21-T-S

CONN HEADER VERT 6POS 2.54MM

Samtec Inc.

0 -
HTSW-106-21-T-S

数据表

HTSW Bulk Active - - - - - - - - - - - - - - - - - - - - - - -
HTSW-108-08-TM-S-RA

HTSW-108-08-TM-S-RA

CONN HEADER R/A 8POS 2.54MM

Samtec Inc.

0 -

-

HTSW Bulk Active Header Male Pin 0.100" (2.54mm) 8 1 - All Board to Board or Cable Unshrouded Through Hole, Right Angle Solder Push-Pull 0.230" (5.84mm) 0.090" (2.29mm) - 0.122" (3.10mm) Square Tin Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - Varies by Wire Gauge
HMTSW-102-07-G-D-230

HMTSW-102-07-G-D-230

CONN HEADER VERT 4POS 2.54MM

Samtec Inc.

0 -
HMTSW-102-07-G-D-230

数据表

Flex Stack, HMTSW Bulk Active Header Male Pin 0.100" (2.54mm) 4 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.230" (5.84mm) 0.100" (2.54mm) 0.430" (10.92mm) 0.100" (2.54mm) Square Gold Gold Phosphor Bronze Liquid Crystal Polymer (LCP) - 3A
HMTSW-102-07-G-D-240

HMTSW-102-07-G-D-240

CONN HEADER VERT 4POS 2.54MM

Samtec Inc.

0 -
HMTSW-102-07-G-D-240

数据表

Flex Stack, HMTSW Bulk Active Header Male Pin 0.100" (2.54mm) 4 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.240" (6.10mm) 0.090" (2.29mm) 0.430" (10.92mm) 0.100" (2.54mm) Square Gold Gold Phosphor Bronze Liquid Crystal Polymer (LCP) - 3A
HMTSW-102-07-G-D-190

HMTSW-102-07-G-D-190

CONN HDR .100" 4POS

Samtec Inc.

0 -
HMTSW-102-07-G-D-190

数据表

Flex Stack, HMTSW Bulk Active Header Male Pin 0.100" (2.54mm) 4 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.190" (4.83mm) 0.140" (3.56mm) 0.430" (10.92mm) 0.100" (2.54mm) Square Gold Gold Phosphor Bronze Liquid Crystal Polymer (LCP) - 3A
HMTSW-102-27-SM-S-1100

HMTSW-102-27-SM-S-1100

CONN HEADER VERT 2POS 2.54MM

Samtec Inc.

0 -
HMTSW-102-27-SM-S-1100

数据表

Flex Stack, HMTSW Bulk Active Header Male Pin 0.100" (2.54mm) 2 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 1.100" (27.94mm) 0.130" (3.30mm) 1.330" (33.78mm) 0.100" (2.54mm) Square Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - 3A
HMTSW-103-07-S-S-200

HMTSW-103-07-S-S-200

CONN HEADER VERT 3POS 2.54MM

Samtec Inc.

0 -
HMTSW-103-07-S-S-200

数据表

Flex Stack, HMTSW Bulk Active Header Male Pin 0.100" (2.54mm) 3 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.200" (5.08mm) 0.130" (3.30mm) 0.430" (10.92mm) 0.100" (2.54mm) Square Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - 3A
HMTSW-104-07-G-S-150

HMTSW-104-07-G-S-150

CONN HEADER VERT 4POS 2.54MM

Samtec Inc.

0 -
HMTSW-104-07-G-S-150

数据表

Flex Stack, HMTSW Bulk Active Header Male Pin 0.100" (2.54mm) 4 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.150" (3.81mm) 0.180" (4.57mm) 0.430" (10.92mm) 0.100" (2.54mm) Square Gold Gold Phosphor Bronze Liquid Crystal Polymer (LCP) - 3A
HMTSW-104-07-G-S-215

HMTSW-104-07-G-S-215

CONN HEADER VERT 4POS 2.54MM

Samtec Inc.

0 -
HMTSW-104-07-G-S-215

数据表

Flex Stack, HMTSW Bulk Active Header Male Pin 0.100" (2.54mm) 4 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.215" (5.46mm) 0.115" (2.92mm) 0.430" (10.92mm) 0.100" (2.54mm) Square Gold Gold Phosphor Bronze Liquid Crystal Polymer (LCP) - 3A
HMTSW-104-07-G-S-240

HMTSW-104-07-G-S-240

CONN HEADER VERT 4POS 2.54MM

Samtec Inc.

0 -
HMTSW-104-07-G-S-240

数据表

Flex Stack, HMTSW Bulk Active Header Male Pin 0.100" (2.54mm) 4 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.240" (6.10mm) 0.090" (2.29mm) 0.430" (10.92mm) 0.100" (2.54mm) Square Gold Gold Phosphor Bronze Liquid Crystal Polymer (LCP) - 3A
HTSW-102-25-G-D-RA

HTSW-102-25-G-D-RA

CONN HEADER R/A 4POS 2.54MM

Samtec Inc.

0 -
HTSW-102-25-G-D-RA

数据表

HTSW Bulk Active - - - - - - - - - - - - - - - - - - - - - - -
HTSW-103-09-S-S-RA

HTSW-103-09-S-S-RA

CONN HEADER R/A 3POS 2.54MM

Samtec Inc.

0 -

-

HTSW Bulk Active Header Male Pin 0.100" (2.54mm) 3 1 - All Board to Board or Cable Unshrouded Through Hole, Right Angle Solder Push-Pull 0.230" (5.84mm) 0.290" (7.37mm) - 0.122" (3.10mm) Square Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - Varies by Wire Gauge
HTSW-103-09-S-S-RE

HTSW-103-09-S-S-RE

CONN HEADER R/A 3POS 2.54MM

Samtec Inc.

0 -

-

HTSW Bulk Active Header Male Pin 0.100" (2.54mm) 3 1 - All Board to Board or Cable Unshrouded Through Hole, Right Angle Solder Push-Pull 0.230" (5.84mm) 0.190" (4.83mm) - 0.122" (3.10mm) Square Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - Varies by Wire Gauge
HTSW-202-08-L-S-RA

HTSW-202-08-L-S-RA

CONN HEADER R/A 2POS 5.08MM

Samtec Inc.

0 -
HTSW-202-08-L-S-RA

数据表

HTSW Bulk Active Header Male Pin 0.200" (5.08mm) 2 1 - All Board to Board or Cable Unshrouded Through Hole, Right Angle Solder Push-Pull 0.230" (5.84mm) 0.090" (2.29mm) - 0.122" (3.10mm) Square Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - Varies by Wire Gauge
HTSW-202-08-LM-S-RA

HTSW-202-08-LM-S-RA

CONN HEADER R/A 2POS 5.08MM

Samtec Inc.

0 -

-

HTSW Bulk Active Header Male Pin 0.200" (5.08mm) 2 1 - All Board to Board or Cable Unshrouded Through Hole, Right Angle Solder Push-Pull 0.230" (5.84mm) 0.090" (2.29mm) - 0.122" (3.10mm) Square Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - Varies by Wire Gauge
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