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制造商 系列 包装 产品状态 连接器类型 触点类型 配对间距 位置数量 行数 行间距 - 配对 已加载位置数 样式 遮蔽 安装类型 端接方式 固定类型 触点长度 - 配对部分 触点长度 - 引脚部分 触点总长度 绝缘高度 触点形状 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点表面处理 - 引脚 触点材料 绝缘材料 特性 工作温度 电流额定值(安培)

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 配对间距 位置数量 行数 行间距 - 配对 已加载位置数 样式 遮蔽 安装类型 端接方式 固定类型 触点长度 - 配对部分 触点长度 - 引脚部分 触点总长度 绝缘高度 触点形状 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点表面处理 - 引脚 触点材料 绝缘材料 特性 工作温度 电流额定值(安培)
TSW-108-29-T-S-RA

TSW-108-29-T-S-RA

CONN HEADER R/A 8POS 2.54MM

Samtec Inc.

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TSW Bulk Active Header Male Pin 0.100" (2.54mm) 8 1 - All Board to Board or Cable Unshrouded Through Hole, Right Angle Solder Push-Pull 0.320" (8.13mm) 0.800" (20.32mm) - 0.119" (3.02mm) Square Tin Tin Phosphor Bronze Polybutylene Terephthalate (PBT) - -
TSW-110-10-T-S-RE

TSW-110-10-T-S-RE

CONN HEADER VERT 10POS 2.54MM

Samtec Inc.

0 -

-

TSW Bulk Active Header Male Pin 0.100" (2.54mm) 10 1 - All Board to Board or Cable Unshrouded Through Hole, Right Angle Solder Push-Pull 0.230" (5.84mm) 0.390" (9.91mm) - 0.119" (3.02mm) Square Tin Tin Phosphor Bronze Polybutylene Terephthalate (PBT) - -
HMTSW-102-08-S-D-310

HMTSW-102-08-S-D-310

CONN HEADER VERT 4POS 2.54MM

Samtec Inc.

0 -
HMTSW-102-08-S-D-310

数据表

Flex Stack, HMTSW Bulk Active Header Male Pin 0.100" (2.54mm) 4 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.310" (7.87mm) 0.120" (3.05mm) 0.530" (13.46mm) 0.100" (2.54mm) Square Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - 3A
HMTSW-102-08-S-D-250

HMTSW-102-08-S-D-250

CONN HDR .100" 4POS

Samtec Inc.

0 -
HMTSW-102-08-S-D-250

数据表

Flex Stack, HMTSW Bulk Active Header Male Pin 0.100" (2.54mm) 4 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.250" (6.35mm) 0.180" (4.57mm) 0.530" (13.46mm) 0.100" (2.54mm) Square Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - 3A
TSW-109-12-T-S-RE

TSW-109-12-T-S-RE

CONN HEADER VERT 9POS 2.54MM

Samtec Inc.

0 -

-

TSW Bulk Active Header Male Pin 0.100" (2.54mm) 9 1 - All Board to Board or Cable Unshrouded Through Hole, Right Angle Solder Push-Pull 0.230" (5.84mm) 0.590" (14.99mm) - 0.119" (3.02mm) Square Tin Tin Phosphor Bronze Polybutylene Terephthalate (PBT) - -
HMTSW-105-24-G-S-230

HMTSW-105-24-G-S-230

CONN HEADER VERT 5POS 2.54MM

Samtec Inc.

0 -
HMTSW-105-24-G-S-230

数据表

Flex Stack, HMTSW Bulk Active Header Male Pin 0.100" (2.54mm) 5 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.230" (5.84mm) 0.150" (3.81mm) 0.480" (12.19mm) 0.100" (2.54mm) Square Gold Gold Phosphor Bronze Liquid Crystal Polymer (LCP) - 3A
HMTSW-104-08-S-S-340

HMTSW-104-08-S-S-340

CONN HEADER VERT 4POS 2.54MM

Samtec Inc.

0 -
HMTSW-104-08-S-S-340

数据表

Flex Stack, HMTSW Bulk Active Header Male Pin 0.100" (2.54mm) 4 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.340" (8.64mm) 0.090" (2.29mm) 0.530" (13.46mm) 0.100" (2.54mm) Square Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - 3A
HMTSW-104-08-S-S-280

HMTSW-104-08-S-S-280

CONN HEADER VERT 4POS 2.54MM

Samtec Inc.

0 -
HMTSW-104-08-S-S-280

数据表

Flex Stack, HMTSW Bulk Active Header Male Pin 0.100" (2.54mm) 4 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.280" (7.11mm) 0.150" (3.81mm) 0.530" (13.46mm) 0.100" (2.54mm) Square Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - 3A
HMTSW-104-08-SM-S-310

HMTSW-104-08-SM-S-310

CONN HEADER VERT 4POS 2.54MM

Samtec Inc.

0 -
HMTSW-104-08-SM-S-310

数据表

Flex Stack, HMTSW Bulk Active Header Male Pin 0.100" (2.54mm) 4 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.310" (7.87mm) 0.120" (3.05mm) 0.530" (13.46mm) 0.100" (2.54mm) Square Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - 3A
HMTSW-104-08-SM-S-315

HMTSW-104-08-SM-S-315

CONN HEADER VERT 4POS 2.54MM

Samtec Inc.

0 -
HMTSW-104-08-SM-S-315

数据表

Flex Stack, HMTSW Bulk Active Header Male Pin 0.100" (2.54mm) 4 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.315" (8.00mm) 0.115" (2.92mm) 0.530" (13.46mm) 0.100" (2.54mm) Square Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - 3A
TSW-204-14-T-S-LL

TSW-204-14-T-S-LL

CONN HDR .200" 4POS

Samtec Inc.

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-

TSW Bulk Active Header Male Pin 0.200" (5.08mm) 4 1 - All Board to Board or Cable Unshrouded Through Hole Kinked Pin, Solder Push-Pull 0.320" (8.13mm) 0.110" (2.79mm) 0.530" (13.46mm) 0.100" (2.54mm) Square Tin Tin Phosphor Bronze Polybutylene Terephthalate (PBT) - -
HTSW-102-09-S-D-RA

HTSW-102-09-S-D-RA

CONN HEADER R/A 4POS 2.54MM

Samtec Inc.

0 -
HTSW-102-09-S-D-RA

数据表

HTSW Bulk Active Header Male Pin 0.100" (2.54mm) 4 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole, Right Angle Solder Push-Pull 0.230" (5.84mm) 0.290" (7.37mm) - 0.240" (6.10mm) Square Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - Varies by Wire Gauge
HMTSW-105-07-TM-D-240

HMTSW-105-07-TM-D-240

CONN HEADER VERT 10POS 2.54MM

Samtec Inc.

0 -
HMTSW-105-07-TM-D-240

数据表

Flex Stack, HMTSW Bulk Active Header Male Pin 0.100" (2.54mm) 10 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.240" (6.10mm) 0.090" (2.29mm) 0.430" (10.92mm) 0.100" (2.54mm) Square Tin Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - 3A
HTSW-104-16-S-S-RA

HTSW-104-16-S-S-RA

CONN HEADER R/A 4POS 2.54MM

Samtec Inc.

0 -

-

HTSW Bulk Active Header Male Pin 0.100" (2.54mm) 4 1 - All Board to Board or Cable Unshrouded Through Hole, Right Angle Solder Push-Pull 0.320" (8.13mm) 0.200" (5.08mm) - 0.122" (3.10mm) Square Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - Varies by Wire Gauge
HTSW-105-22-G-S-RA

HTSW-105-22-G-S-RA

CONN HEADER R/A 5POS 2.54MM

Samtec Inc.

0 -
HTSW-105-22-G-S-RA

数据表

HTSW Bulk Active - - - - - - - - - - - - - - - - - - - - - - -
HTSW-105-10-G-S-RA

HTSW-105-10-G-S-RA

CONN HEADER R/A 5POS 2.54MM

Samtec Inc.

0 -
HTSW-105-10-G-S-RA

数据表

HTSW Bulk Active Header Male Pin 0.100" (2.54mm) 5 1 - All Board to Board or Cable Unshrouded Through Hole, Right Angle Solder Push-Pull 0.230" (5.84mm) 0.390" (9.91mm) - 0.122" (3.10mm) Square Gold Gold Phosphor Bronze Liquid Crystal Polymer (LCP) - Varies by Wire Gauge
TSM-102-01-T-DV-LC

TSM-102-01-T-DV-LC

CONN HEADER SMD 4POS 2.54MM

Samtec Inc.

0 -
TSM-102-01-T-DV-LC

数据表

TSM Bulk Active Header, Cuttable Male Pin 0.100" (2.54mm) 4 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.230" (5.84mm) - - 0.100" (2.54mm) Square Tin Tin Phosphor Bronze Liquid Crystal Polymer (LCP) Board Lock -
HTSW-104-09-L-S-RE-002

HTSW-104-09-L-S-RE-002

CONN HEADER R/A 4POS 2.54MM

Samtec Inc.

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-

HTSW Bulk Active Header Male Pin 0.100" (2.54mm) 4 1 - 3 Board to Board or Cable Unshrouded Through Hole, Right Angle Solder Push-Pull 0.230" (5.84mm) 0.190" (4.83mm) - 0.122" (3.10mm) Square Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - Varies by Wire Gauge
MTMS-103-51-S-S-157

MTMS-103-51-S-S-157

CONN HDR .050" 3POS

Samtec Inc.

0 -

-

Flex Stack, MTMS Bulk Active Header Male Pin 0.050" (1.27mm) 3 1 - All Board to Board Unshrouded Through Hole Solder Push-Pull 0.157" (4.00mm) 0.153" (3.89mm) 0.410" (10.41mm) 0.100" (2.54mm) Square Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - -
HTMS-102-03-S-S-RA

HTMS-102-03-S-S-RA

CONN HDR .050" 10POS

Samtec Inc.

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-

HTMS Bulk Active Header Male Pin 0.050" (1.27mm) 2 1 - All Board to Board Unshrouded Through Hole, Right Angle Solder Push-Pull 0.125" (3.18mm) 0.140" (3.56mm) - 0.096" (2.44mm) Square Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - 5A per Contact
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