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| 图片 | 厂商型号 | 可用性 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 连接器类型 | 触点类型 | 配对间距 | 位置数量 | 行数 | 行间距 - 配对 | 已加载位置数 | 样式 | 遮蔽 | 安装类型 | 端接方式 | 固定类型 | 触点长度 - 配对部分 | 触点长度 - 引脚部分 | 触点总长度 | 绝缘高度 | 触点形状 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点表面处理 - 引脚 | 触点材料 | 绝缘材料 | 特性 | 工作温度 | 电流额定值（安培） |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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HMTSW-106-06-G-S-135CONN HEADER VERT 6POS 2.54MM |
0 | - |
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数据表 |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 6 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.135" (3.43mm) | 0.065" (1.65mm) | 0.300" (7.62mm) | 0.100" (2.54mm) | Square | Gold | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3A | ||
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HMTSW-106-06-G-S-150CONN HEADER VERT 6POS 2.54MM |
0 | - |
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数据表 |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 6 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.150" (3.81mm) | 0.050" (1.27mm) | 0.300" (7.62mm) | 0.100" (2.54mm) | Square | Gold | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3A | ||
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HMTSW-106-22-G-S-400CONN HEADER VERT 6POS 2.54MM |
0 | - |
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数据表 |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 6 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.400" (10.16mm) | 0.130" (3.30mm) | 0.630" (16.00mm) | 0.100" (2.54mm) | Square | Gold | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3A | ||
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HMTSW-106-22-G-S-001.100" HIGH-TEMP VARIABLE POST HE |
0 | - |
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数据表 |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 6 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.001" (0.03mm) | 0.529" (13.44mm) | 0.630" (16.00mm) | 0.100" (2.54mm) | Square | Gold | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3A | ||
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TSW-203-05-L-S-LLCONN HDR .200" 3POS |
0 | - |
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- |
TSW | Bulk | Active | Header | Male Pin | 0.200" (5.08mm) | 3 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Kinked Pin, Solder | Push-Pull | 0.105" (2.67mm) | 0.130" (3.30mm) | 0.335" (8.51mm) | 0.100" (2.54mm) | Square | Gold | Tin | Phosphor Bronze | Polybutylene Terephthalate (PBT) | - | - | ||
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HMTSW-105-10-TM-D-640CONN HEADER VERT 10POS 2.54MM |
0 | - |
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数据表 |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 10 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.640" (16.26mm) | 0.090" (2.29mm) | 0.830" (21.08mm) | 0.100" (2.54mm) | Square | Tin | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3A | ||
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MTSW-103-22-L-D-330-RACONN HEADER R/A 6POS 2.54MM |
0 | - |
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数据表 |
Flex Stack, MTSW | Bulk | Active | Header, Cuttable | Male Pin | 0.100" (2.54mm) | 6 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole, Right Angle | Solder | Push-Pull | 0.330" (8.38mm) | 0.090" (2.29mm) | - | 0.219" (5.56mm) | Square | Gold | Tin | Phosphor Bronze | Polyester, Glass Filled | - | 3A | ||
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HMTSW-103-07-G-D-120-RACONN HEADER R/A 6POS 2.54MM |
0 | - |
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数据表 |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 6 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole, Right Angle | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.240" (6.10mm) | Square | Gold | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3A | ||
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HMTSW-103-10-LM-D-460-RACONN HEADER R/A 6POS 2.54MM |
0 | - |
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数据表 |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 6 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole, Right Angle | Solder | Push-Pull | 0.460" (11.68mm) | - | - | 0.240" (6.10mm) | Square | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3A | ||
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HMTSW-106-07-G-S-007-RACONN HEADER R/A 6POS 2.54MM |
0 | - |
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数据表 |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 6 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole, Right Angle | Solder | Push-Pull | 0.007" (0.18mm) | - | - | 0.122" (3.10mm) | Square | Gold | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3A | ||
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HMTSW-106-12-L-S-770CONN HEADER VERT 6POS 2.54MM |
0 | - |
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数据表 |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 6 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.770" (19.56mm) | 0.160" (4.06mm) | 1.030" (26.16mm) | 0.100" (2.54mm) | Square | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3A | ||
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HTSW-103-08-G-Q-RACONN HEADER R/A 9POS 2.54MM |
0 | - |
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数据表 |
HTSW | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
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HMTSW-106-08-T-D-225CONN HEADER VERT 12POS 2.54MM |
0 | - |
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数据表 |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 12 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.225" (5.72mm) | 0.205" (5.21mm) | 0.530" (13.46mm) | 0.100" (2.54mm) | Square | Tin | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3A | ||
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HMTSW-106-08-T-D-300CONN HEADER VERT 12POS 2.54MM |
0 | - |
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数据表 |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 12 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.300" (7.62mm) | 0.130" (3.30mm) | 0.530" (13.46mm) | 0.100" (2.54mm) | Square | Tin | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3A | ||
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HMTSW-106-08-T-D-320CONN HEADER VERT 12POS 2.54MM |
0 | - |
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数据表 |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 12 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.320" (8.13mm) | 0.110" (2.79mm) | 0.530" (13.46mm) | 0.100" (2.54mm) | Square | Tin | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3A | ||
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HMTSW-106-10-L-S-453-RACONN HDR .100" 6POS |
0 | - |
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数据表 |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 6 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole, Right Angle | Solder | Push-Pull | 0.453" (11.51mm) | - | - | 0.122" (3.10mm) | Square | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3A | ||
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HMTSW-107-09-L-S-540.100" HIGH-TEMP VARIABLE POST HE |
0 | - |
|
数据表 |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 7 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.540" (13.72mm) | 0.090" (2.29mm) | 0.730" (18.54mm) | 0.100" (2.54mm) | Square | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3A | ||
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HTMS-103-56-G-SCONN HDR .050" 10POS |
0 | - |
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数据表 |
HTMS | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
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TMS-103-58-G-S.050" (1.27MM) MICRO HEADER |
0 | - |
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- |
TMS | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 3 | 1 | - | All | Board to Board | Unshrouded | Through Hole | Solder | Push-Pull | 0.485" (12.32mm) | 0.120" (3.05mm) | 0.705" (17.91mm) | 0.100" (2.54mm) | Square | Gold | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 5A per Contact | ||
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BBL-101-G-FCONN HEADER VERT 1POS |
0 | - |
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数据表 |
BBL | Bulk | Active | Header | Male Pin | - | 1 | 1 | - | All | Board to Board | Unshrouded | Through Hole | Solder | Push-Pull | 0.122" (3.10mm) | 0.125" (3.18mm) | 0.332" (8.43mm) | 0.085" (2.15mm) | Circular | Gold | Nickel | - | Liquid Crystal Polymer (LCP) | - | - |
