排针、插座、母插座

制造商 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值
ESW-106-33-G-S

ESW-106-33-G-S

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-106-33-G-S

数据表

ESW Bulk Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESQT-106-02-L-S-535

ESQT-106-02-L-S-535

FLEXYZ FLEXIBLE-HEIGHT SOCKET ST

Samtec Inc.

40 -
ESQT-106-02-L-S-535

数据表

ESQT Bulk Active Elevated Socket Forked Board to Board or Cable 6 All 0.079" (2.00mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.535" (13.60mm) 0.315" (8.00mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESW-105-48-G-S

ESW-105-48-G-S

CONN SOCKET 5POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-105-48-G-S

数据表

ESW Bulk Active Elevated Socket Forked Board to Board 5 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESW-104-14-G-S-LL

ESW-104-14-G-S-LL

CONN SOCKET 4POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-104-14-G-S-LL

数据表

ESW Bulk Active Elevated Socket Forked Board to Board 4 All 0.100" (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435" (11.05mm) 0.480" (12.19mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESW-103-23-L-D

ESW-103-23-L-D

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-103-23-L-D

数据表

ESW Bulk Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
SSM-103-L-SH-LC

SSM-103-L-SH-LC

CONN RCPT 3POS 0.1 GOLD SMD R/A

Samtec Inc.

99 -

-

Tiger Claw™ SSM Tube Active Receptacle Female Socket Board to Board or Cable 3 All 0.100" (2.54mm) 1 - Surface Mount, Right Angle Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.125" (3.18mm) - -55°C ~ 125°C - - - Board Lock 5.2A per Contact
ESW-106-23-G-S-LL

ESW-106-23-G-S-LL

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-106-23-G-S-LL

数据表

ESW Bulk Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESQ-107-13-T-S

ESQ-107-13-T-S

CONN SOCKET 7POS 0.1 TIN PCB

Samtec Inc.

0 -
ESQ-107-13-T-S

数据表

ESQ Bulk Active Elevated Socket Forked Board to Board 7 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 105°C UL94 V-0 - - - 5.7A per Contact
ESW-104-33-S-S-LL

ESW-104-33-S-S-LL

CONN SOCKET 4POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-104-33-S-S-LL

数据表

ESW Bulk Active Elevated Socket Forked Board to Board 4 All 0.100" (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
HLE-103-02-F-DV-LC

HLE-103-02-F-DV-LC

CONN RCPT 6POS 0.1 GOLD SMD

Samtec Inc.

55 -
HLE-103-02-F-DV-LC

数据表

HLE Tube Active Receptacle Female Socket Board to Board 6 All 0.100" (2.54mm) 2 0.100" (2.54mm) Surface Mount Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.144" (3.66mm) - -55°C ~ 125°C - - - Board Lock 4.1A per Contact
ESQ-104-13-T-D

ESQ-104-13-T-D

CONN SOCKET 8POS 0.1 TIN PCB

Samtec Inc.

0 -
ESQ-104-13-T-D

数据表

ESQ Bulk Active Elevated Socket Forked Board to Board 8 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 105°C UL94 V-0 - - - 5.7A per Contact
ESW-104-34-G-S

ESW-104-34-G-S

CONN SOCKET 4POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-104-34-G-S

数据表

ESW Bulk Active Elevated Socket Forked Board to Board 4 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635" (16.13mm) 0.280" (7.11mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESW-106-33-S-S

ESW-106-33-S-S

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-106-33-S-S

数据表

ESW Bulk Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESW-102-23-G-D-LL

ESW-102-23-G-D-LL

CONN SOCKET 4POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-102-23-G-D-LL

数据表

ESW Bulk Active Elevated Socket Forked Board to Board 4 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESQ-101-44-G-S

ESQ-101-44-G-S

CONN SOCKET 1POS GOLD PCB

Samtec Inc.

0 -
ESQ-101-44-G-S

数据表

ESQ Bulk Active Elevated Socket Forked Board to Board 1 All - 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.735" (18.67mm) 0.180" (4.57mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESW-104-23-F-D

ESW-104-23-F-D

CONN SOCKET 8POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-104-23-F-D

数据表

ESW Bulk Active Elevated Socket Forked Board to Board 8 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESW-105-48-S-S

ESW-105-48-S-S

CONN SOCKET 5POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-105-48-S-S

数据表

ESW Bulk Active Elevated Socket Forked Board to Board 5 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESW-105-58-G-S

ESW-105-58-G-S

CONN SOCKET 5POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-105-58-G-S

数据表

ESW Bulk Active Elevated Socket Forked Board to Board 5 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESW-106-48-G-S

ESW-106-48-G-S

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-106-48-G-S

数据表

ESW Bulk Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESQ-103-12-T-D

ESQ-103-12-T-D

CONN SOCKET 6POS 0.1 TIN PCB

Samtec Inc.

0 -
ESQ-103-12-T-D

数据表

ESQ Bulk Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 - - - 5.7A per Contact
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