排针、插座、母插座

制造商 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值
ESW-107-14-T-S

ESW-107-14-T-S

CONN SOCKET 7POS 0.1 TIN PCB

Samtec Inc.

0 -
ESW-107-14-T-S

数据表

ESW Tube Active Elevated Socket Forked Board to Board 7 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.480" (12.19mm) -55°C ~ 105°C UL94 V-0 - - - 5.2A per Contact
ESQ-103-33-G-S-LL

ESQ-103-33-G-S-LL

CONN SOCKET 3POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-103-33-G-S-LL

数据表

ESQ Bulk Active Elevated Socket Forked Board to Board 3 All 0.100" (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESQ-103-23-S-S-LL

ESQ-103-23-S-S-LL

CONN SOCKET 3POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-103-23-S-S-LL

数据表

ESQ Bulk Active Elevated Socket Forked Board to Board 3 All 0.100" (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESQ-106-33-L-S

ESQ-106-33-L-S

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-106-33-L-S

数据表

ESQ Bulk Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
801-43-011-10-001000

801-43-011-10-001000

CONN RCPT 11POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

100 -
801-43-011-10-001000

数据表

801 Bulk Active Receptacle Female Socket Board to Board 11 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.276" (7.00mm) 0.118" (3.00mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A
ESQ-107-23-G-S

ESQ-107-23-G-S

CONN SOCKET 7POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-107-23-G-S

数据表

ESQ Bulk Active Elevated Socket Forked Board to Board 7 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESQ-109-13-L-S

ESQ-109-13-L-S

CONN SOCKET 9POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-109-13-L-S

数据表

ESQ Bulk Active Elevated Socket Forked Board to Board 9 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESW-103-44-G-D

ESW-103-44-G-D

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-103-44-G-D

数据表

ESW Bulk Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.735" (18.67mm) 0.180" (4.57mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
CES-112-01-T-D

CES-112-01-T-D

CONN RCPT 24POS 0.1 TIN PCB

Samtec Inc.

100 -
CES-112-01-T-D

数据表

CES Bulk Active Receptacle Female Socket Board to Board 24 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.200" (5.08mm) 0.128" (3.25mm) -55°C ~ 105°C UL94 V-0 - - - -
ESQ-105-24-L-S

ESQ-105-24-L-S

CONN SOCKET 5POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-105-24-L-S

数据表

ESQ Bulk Active Elevated Socket Forked Board to Board 5 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
SQT-109-01-L-S-005

SQT-109-01-L-S-005

CONN RCPT 9POS 0.079 GOLD PCB

Samtec Inc.

0 -

-

SQT Tube Active Receptacle Forked Board to Board or Cable 9 8 0.079" (2.00mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.250" (6.35mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.1A per Contact
ESW-103-34-G-D-LL

ESW-103-34-G-D-LL

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-103-34-G-D-LL

数据表

ESW Bulk Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635" (16.13mm) 0.280" (7.11mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESW-105-48-L-D-LL

ESW-105-48-L-D-LL

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-105-48-L-D-LL

数据表

ESW Bulk Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESQ-107-33-T-D-LL

ESQ-107-33-T-D-LL

CONN SOCKET 14POS 0.1 TIN PCB

Samtec Inc.

0 -
ESQ-107-33-T-D-LL

数据表

ESQ Bulk Active Elevated Socket Forked Board to Board 14 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Tin - Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 - - - 5.7A per Contact
ESQ-106-13-T-D

ESQ-106-13-T-D

CONN SOCKET 12POS 0.1 TIN PCB

Samtec Inc.

0 -
ESQ-106-13-T-D

数据表

ESQ Bulk Active Elevated Socket Forked Board to Board 12 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 105°C UL94 V-0 - - - 5.7A per Contact
ESW-105-58-L-D

ESW-105-58-L-D

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-105-58-L-D

数据表

ESW Bulk Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
MMS-106-01-L-DV

MMS-106-01-L-DV

CONN RCPT 12POS 0.079 GOLD PCB

Samtec Inc.

99 -
MMS-106-01-L-DV

数据表

MMS Bulk Active Receptacle Female Socket Board to Board or Cable 12 All 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.175" (4.45mm) 0.115" (2.92mm) -55°C ~ 125°C - - - - 3.9A per Contact
ESQ-106-58-S-S

ESQ-106-58-S-S

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-106-58-S-S

数据表

ESQ Bulk Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESW-108-13-T-S

ESW-108-13-T-S

CONN SOCKET 8POS 0.1 TIN PCB

Samtec Inc.

0 -
ESW-108-13-T-S

数据表

ESW Tube Active Elevated Socket Forked Board to Board 8 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 105°C UL94 V-0 - - - 5.2A per Contact
ESW-105-44-T-S-LL

ESW-105-44-T-S-LL

CONN SOCKET 5POS 0.1 TIN PCB

Samtec Inc.

0 -
ESW-105-44-T-S-LL

数据表

ESW Tube Active Elevated Socket Forked Board to Board 5 All 0.100" (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Tin - Black 0.735" (18.67mm) 0.180" (4.57mm) -55°C ~ 105°C UL94 V-0 - - - 5.2A per Contact
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