排针、插座、母插座

制造商 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值

全部重置
全部应用
结果
图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值
ESW-108-12-F-D

ESW-108-12-F-D

CONN SOCKET 16POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-108-12-F-D 数据表 ESW Tube Active Elevated Socket Forked Board to Board 16 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
SQW-118-01-L-D

SQW-118-01-L-D

CONN RCPT 2MM 36POS DL VERT PCB

Samtec Inc.

0 -
SQW-118-01-L-D 数据表 SQW Tube Active Receptacle Forked Board to Board or Cable 36 All 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.250" (6.35mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 3.8A per Contact
SSM-110-L-SV-BE-LC-P

SSM-110-L-SV-BE-LC-P

CONN RCPT 10POS 0.1 GOLD SMD

Samtec Inc.

0 -
SSM-110-L-SV-BE-LC-P 数据表 Tiger Claw™ SSM Tube Active Receptacle, Bottom Entry Female Socket Board to Board or Cable 10 All 0.100" (2.54mm) 1 - Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.290" (7.37mm) - -55°C ~ 125°C - - - Board Lock, Pick and Place 5.2A per Contact
ESW-109-13-G-S

ESW-109-13-G-S

CONN SOCKET 9POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-109-13-G-S 数据表 ESW Tube Active Elevated Socket Forked Board to Board 9 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESW-108-34-T-D

ESW-108-34-T-D

CONN SOCKET 16POS 0.1 TIN PCB

Samtec Inc.

0 -
ESW-108-34-T-D 数据表 ESW Tube Active Elevated Socket Forked Board to Board 16 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.635" (16.13mm) 0.280" (7.11mm) -55°C ~ 105°C UL94 V-0 - - - 5.2A per Contact
TLE-103-01-G-DV-A-TR

TLE-103-01-G-DV-A-TR

CONN RCPT 6POS 0.079 GOLD SMD

Samtec Inc.

0 -
TLE-103-01-G-DV-A-TR 数据表 TLE Tape & Reel (TR) Active Receptacle, Pass Through Female Socket Board to Board or Cable 6 All 0.079" (2.00mm) 2 0.079" (2.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.177" (4.50mm) - -55°C ~ 125°C - - - Board Guide 3.2A per Contact
ESQ-107-58-G-D

ESQ-107-58-G-D

CONN SOCKET 14POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-107-58-G-D 数据表 ESQ Bulk Active Elevated Socket Forked Board to Board 14 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESQ-108-37-G-S

ESQ-108-37-G-S

CONN SOCKET 8POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-108-37-G-S 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 8 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
HLE-103-02-G-DV-PE-LC

HLE-103-02-G-DV-PE-LC

CONN RCPT 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
HLE-103-02-G-DV-PE-LC 数据表 HLE Tube Active Receptacle, Pass Through Female Socket Board to Board 6 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.138" (3.50mm) 0.090" (2.29mm) -55°C ~ 125°C - - - Board Lock 4.1A per Contact
RSM-112-02-T-S-K

RSM-112-02-T-S-K

CONN RCPT 12POS 0.05 TIN SMD

Samtec Inc.

0 -
RSM-112-02-T-S-K 数据表 RSM Tube Active Receptacle Female Socket Board to Board 12 All 0.050" (1.27mm) 1 - Surface Mount Solder Push-Pull Tin - Black 0.240" (6.10mm) - -55°C ~ 125°C UL94 V-0 - - Pick and Place 3.1A per Contact
ESQ-106-23-L-T

ESQ-106-23-L-T

CONN SOCKET 18POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-106-23-L-T 数据表 ESQ Bulk Active Elevated Socket Forked Board to Board 18 All 0.100" (2.54mm) 3 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
TLE-105-01-G-DV-K

TLE-105-01-G-DV-K

CONN RCPT 10POS 0.079 GOLD SMD

Samtec Inc.

0 -
TLE-105-01-G-DV-K 数据表 TLE Tube Active Receptacle, Pass Through Female Socket Board to Board or Cable 10 All 0.079" (2.00mm) 2 0.079" (2.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.177" (4.50mm) - -55°C ~ 125°C - - - Pick and Place 3.2A per Contact
ESQ-104-33-S-D

ESQ-104-33-S-D

CONN SOCKET 8POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-104-33-S-D 数据表 ESQ Bulk Active Elevated Socket Forked Board to Board 8 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESQ-104-23-S-D-LL

ESQ-104-23-S-D-LL

CONN SOCKET 8POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-104-23-S-D-LL 数据表 ESQ Bulk Active Elevated Socket Forked Board to Board 8 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESQ-104-23-G-D-008

ESQ-104-23-G-D-008

CONN SOCKET 8POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-104-23-G-D-008 数据表 ESQ Bulk Active Elevated Socket Forked Board to Board 8 7 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
SSQ-124-03-T-D

SSQ-124-03-T-D

CONN RCPT 48POS 0.1 TIN PCB

Samtec Inc.

48 -
SSQ-124-03-T-D 数据表 SSQ Bulk Active Receptacle Forked Board to Board or Cable 48 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.335" (8.51mm) 0.394" (10.00mm) -55°C ~ 105°C UL94 V-0 - - - -
ESQ-115-12-G-S-LL

ESQ-115-12-G-S-LL

CONN SOCKET 15POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-115-12-G-S-LL 数据表 ESQ Bulk Active Elevated Socket Forked Board to Board 15 All 0.100" (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESQ-108-13-S-S

ESQ-108-13-S-S

CONN SOCKET 8POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-108-13-S-S 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 8 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESQ-109-13-T-D

ESQ-109-13-T-D

CONN SOCKET 18POS 0.1 TIN PCB

Samtec Inc.

0 -
ESQ-109-13-T-D 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 18 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 105°C UL94 V-0 - - - 5.7A per Contact
ESW-110-33-L-S

ESW-110-33-L-S

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-110-33-L-S 数据表 ESW Tube Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
深圳市宝利科技有限公司

搜索

深圳市宝利科技有限公司

产品

深圳市宝利科技有限公司

电话

深圳市宝利科技有限公司

用户