排针、插座、母插座

制造商 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值
ESW-116-33-T-S

ESW-116-33-T-S

CONN SOCKET 16POS 0.1 TIN PCB

Samtec Inc.

0 -
ESW-116-33-T-S 数据表 ESW Tube Active Elevated Socket Forked Board to Board 16 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 - - - 5.2A per Contact
SQT-124-01-L-S

SQT-124-01-L-S

CONN RCPT 24POS 0.079 GOLD PCB

Samtec Inc.

56 -
SQT-124-01-L-S 数据表 SQT Bulk Active Receptacle Forked Board to Board or Cable 24 All 0.079" (2.00mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.250" (6.35mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.1A per Contact
ESW-111-12-T-D

ESW-111-12-T-D

CONN SOCKET 22POS 0.1 TIN PCB

Samtec Inc.

0 -
ESW-111-12-T-D 数据表 ESW Tube Active Elevated Socket Forked Board to Board 22 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 - - - 5.2A per Contact
SMM-113-02-L-D

SMM-113-02-L-D

CONN RCPT 26POS 0.079 GOLD SMD

Samtec Inc.

86 -
SMM-113-02-L-D 数据表 Tiger Eye™ SMM Tube Active Receptacle Female Socket Board to Board or Cable 26 All 0.079" (2.00mm) 2 0.079" (2.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.140" (3.56mm) - -55°C ~ 125°C UL94 V-0 - - - 3.2A per Contact
RSM-107-02-T-D-P

RSM-107-02-T-D-P

CONN RCPT 14POS 0.05 TIN SMD

Samtec Inc.

0 -
RSM-107-02-T-D-P 数据表 RSM Tube Active Receptacle Female Socket Board to Board 14 All 0.050" (1.27mm) 2 0.100" (2.54mm) Surface Mount Solder Push-Pull Tin - Black 0.240" (6.10mm) - -55°C ~ 125°C UL94 V-0 - - Pick and Place 3.1A per Contact
ESQ-106-69-S-S

ESQ-106-69-S-S

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-106-69-S-S 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.735" (18.67mm) 0.180" (4.57mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESQ-108-23-S-S

ESQ-108-23-S-S

CONN SOCKET 8POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-108-23-S-S 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 8 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESQ-109-23-T-D

ESQ-109-23-T-D

CONN SOCKET 18POS 0.1 TIN PCB

Samtec Inc.

0 -
ESQ-109-23-T-D 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 18 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 105°C UL94 V-0 - - - 5.7A per Contact
ESQ-104-24-S-D

ESQ-104-24-S-D

CONN SOCKET 8POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-104-24-S-D 数据表 ESQ Bulk Active Elevated Socket Forked Board to Board 8 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
HLE-103-02-G-DV-P

HLE-103-02-G-DV-P

CONN RCPT 6POS 0.1 GOLD SMD

Samtec Inc.

0 -
HLE-103-02-G-DV-P 数据表 HLE Tube Active Receptacle Female Socket Board to Board 6 All 0.100" (2.54mm) 2 0.100" (2.54mm) Surface Mount Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.144" (3.66mm) - -55°C ~ 125°C - - - Pick and Place 4.1A per Contact
HLE-104-02-L-DV-P

HLE-104-02-L-DV-P

CONN RCPT 8POS 0.1 GOLD SMD

Samtec Inc.

0 -
HLE-104-02-L-DV-P 数据表 HLE Tube Active Receptacle Female Socket Board to Board 8 All 0.100" (2.54mm) 2 0.100" (2.54mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.144" (3.66mm) - -55°C ~ 125°C - - - Pick and Place 4.1A per Contact
SSQ-130-01-T-D-LL

SSQ-130-01-T-D-LL

CONN RCPT 60POS 0.1 TIN PCB

Samtec Inc.

0 -
SSQ-130-01-T-D-LL 数据表 SSQ Bulk Active Receptacle Forked Board to Board or Cable 60 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Press-Fit, Solder Push-Pull Tin - Black 0.335" (8.51mm) 0.104" (2.64mm) -55°C ~ 105°C UL94 V-0 - - - -
SSW-120-01-G-D-018

SSW-120-01-G-D-018

CONN RCPT 40POS 0.1 GOLD PCB

Samtec Inc.

0 -
SSW-120-01-G-D-018 数据表 SSW Bulk Active Receptacle Forked Board to Board or Cable 40 39 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.335" (8.51mm) 0.104" (2.64mm) -55°C ~ 125°C UL94 V-0 - - - 4.7A per Contact
SSW-120-01-G-D-019

SSW-120-01-G-D-019

CONN RCPT 40POS 0.1 GOLD PCB

Samtec Inc.

0 -
SSW-120-01-G-D-019 数据表 SSW Bulk Active Receptacle Forked Board to Board or Cable 40 39 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.335" (8.51mm) 0.104" (2.64mm) -55°C ~ 125°C UL94 V-0 - - - 4.7A per Contact
SSW-120-01-G-D-021

SSW-120-01-G-D-021

CONN RCPT 40POS 0.1 GOLD PCB

Samtec Inc.

0 -
SSW-120-01-G-D-021 数据表 SSW Bulk Active Receptacle Forked Board to Board or Cable 40 39 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.335" (8.51mm) 0.104" (2.64mm) -55°C ~ 125°C UL94 V-0 - - - 4.7A per Contact
RSM-112-02-T-S-P

RSM-112-02-T-S-P

CONN RCPT 12POS 0.05 TIN SMD

Samtec Inc.

0 -
RSM-112-02-T-S-P 数据表 RSM Tube Active Receptacle Female Socket Board to Board 12 All 0.050" (1.27mm) 1 - Surface Mount Solder Push-Pull Tin - Black 0.240" (6.10mm) - -55°C ~ 125°C UL94 V-0 - - Pick and Place 3.1A per Contact
SQT-122-01-L-S-RA

SQT-122-01-L-S-RA

CONN RCPT 22P 0.079 GOLD PCB R/A

Samtec Inc.

0 -
SQT-122-01-L-S-RA 数据表 SQT Bulk Active Receptacle Forked Board to Board or Cable 22 All 0.079" (2.00mm) 1 - Through Hole, Right Angle Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.079" (2.00mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.1A per Contact
SSW-116-22-F-S-VS-P

SSW-116-22-F-S-VS-P

CONN RCPT 16POS 0.1 GOLD SMD

Samtec Inc.

0 -
SSW-116-22-F-S-VS-P 数据表 SSW Tube Active Receptacle Forked Board to Board or Cable 16 All 0.100" (2.54mm) 1 - Surface Mount Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.335" (8.51mm) - -55°C ~ 125°C UL94 V-0 - - Pick and Place 4.7A per Contact
ESQ-108-23-G-S-LL

ESQ-108-23-G-S-LL

CONN SOCKET 8POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-108-23-G-S-LL 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 8 All 0.100" (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESW-106-12-G-D

ESW-106-12-G-D

CONN SOCKET 12POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-106-12-G-D 数据表 ESW Tube Active Elevated Socket Forked Board to Board 12 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
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