排针、插座、母插座

制造商 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值
RSM-109-02-S-S-P

RSM-109-02-S-S-P

CONN RCPT 9POS 0.05 GOLD SMD

Samtec Inc.

0 -
RSM-109-02-S-S-P 数据表 RSM Tube Active Receptacle Female Socket Board to Board 9 All 0.050" (1.27mm) 1 - Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.240" (6.10mm) - -55°C ~ 125°C UL94 V-0 - - Pick and Place 3.1A per Contact
ESQ-105-34-S-D

ESQ-105-34-S-D

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-105-34-S-D 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.635" (16.13mm) 0.280" (7.11mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESQ-107-12-S-D-008

ESQ-107-12-S-D-008

CONN SOCKET 14POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-107-12-S-D-008 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 14 13 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESQ-107-12-S-D-012

ESQ-107-12-S-D-012

CONN SOCKET 14POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-107-12-S-D-012 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 14 13 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESW-105-59-S-D

ESW-105-59-S-D

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-105-59-S-D 数据表 ESW Tube Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.635" (16.13mm) 0.280" (7.11mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESW-106-59-G-D

ESW-106-59-G-D

CONN SOCKET 12POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-106-59-G-D 数据表 ESW Tube Active Elevated Socket Forked Board to Board 12 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635" (16.13mm) 0.280" (7.11mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESW-108-33-F-D

ESW-108-33-F-D

CONN SOCKET 16POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-108-33-F-D 数据表 ESW Tube Active Elevated Socket Forked Board to Board 16 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESQ-112-13-S-S

ESQ-112-13-S-S

CONN SOCKET 12POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-112-13-S-S 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 12 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESQ-122-23-T-S

ESQ-122-23-T-S

CONN SOCKET 22POS 0.1 TIN PCB

Samtec Inc.

0 -
ESQ-122-23-T-S 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 22 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 105°C UL94 V-0 - - - 5.7A per Contact
ESW-124-23-T-S

ESW-124-23-T-S

CONN SOCKET 24POS 0.1 TIN PCB

Samtec Inc.

0 -
ESW-124-23-T-S 数据表 ESW Tube Active Elevated Socket Forked Board to Board 24 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 105°C UL94 V-0 - - - 5.2A per Contact
ESQ-121-33-T-S

ESQ-121-33-T-S

CONN SOCKET 21POS 0.1 TIN PCB

Samtec Inc.

0 -
ESQ-121-33-T-S 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 21 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 - - - 5.7A per Contact
SQT-116-01-LM-S

SQT-116-01-LM-S

CONN RCPT 16POS 0.079 GOLD PCB

Samtec Inc.

0 -
SQT-116-01-LM-S 数据表 SQT Tube Active Receptacle Forked Board to Board or Cable 16 All 0.079" (2.00mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.250" (6.35mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.1A per Contact
ESW-110-44-L-S

ESW-110-44-L-S

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-110-44-L-S 数据表 ESW Tube Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.735" (18.67mm) 0.180" (4.57mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESQ-105-12-G-D-LL

ESQ-105-12-G-D-LL

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-105-12-G-D-LL 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESW-116-12-F-S

ESW-116-12-F-S

CONN SOCKET 16POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-116-12-F-S 数据表 ESW Bulk Active Elevated Socket Forked Board to Board 16 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESW-113-44-L-S

ESW-113-44-L-S

CONN SOCKET 13POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-113-44-L-S 数据表 ESW Tube Active Elevated Socket Forked Board to Board 13 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.735" (18.67mm) 0.180" (4.57mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
TLE-109-01-G-DV

TLE-109-01-G-DV

CONN RCPT 18POS 0.079 GOLD SMD

Samtec Inc.

0 -
TLE-109-01-G-DV 数据表 TLE Bulk Discontinued at Digi-Key Receptacle, Pass Through Female Socket Board to Board or Cable 18 All 0.079" (2.00mm) 2 0.079" (2.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.177" (4.50mm) - -55°C ~ 125°C - - - - 3.2A per Contact
HLE-103-02-S-DV-BE-P

HLE-103-02-S-DV-BE-P

CONN RCPT 6POS 0.1 GOLD SMD

Samtec Inc.

0 -
HLE-103-02-S-DV-BE-P 数据表 HLE Tube Active Receptacle, Bottom Entry Female Socket Board to Board 6 All 0.100" (2.54mm) 2 0.100" (2.54mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.144" (3.66mm) - -55°C ~ 125°C - - - Pick and Place 4.1A per Contact
HLE-104-02-L-DV-A-K

HLE-104-02-L-DV-A-K

CONN RCPT 8POS 0.1 GOLD SMD

Samtec Inc.

0 -
HLE-104-02-L-DV-A-K 数据表 HLE Tube Active Receptacle Female Socket Board to Board 8 All 0.100" (2.54mm) 2 0.100" (2.54mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.144" (3.66mm) - -55°C ~ 125°C - - - Board Guide, Pick and Place 4.1A per Contact
SSM-105-L-DV-LC-009

SSM-105-L-DV-LC-009

CONN RCPT 10POS 0.1 GOLD SMD

Samtec Inc.

0 -
SSM-105-L-DV-LC-009 数据表 Tiger Claw™ SSM Tube Active Receptacle, Pass Through Female Socket Board to Board or Cable 10 9 0.100" (2.54mm) 2 0.100" (2.54mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.290" (7.37mm) - -55°C ~ 125°C - - - Board Lock 5.2A per Contact
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