排针、插座、母插座

制造商 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值
ESW-117-12-T-D

ESW-117-12-T-D

CONN SOCKET 34POS 0.1 TIN PCB

Samtec Inc.

0 -
ESW-117-12-T-D 数据表 ESW Tube Active Elevated Socket Forked Board to Board 34 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 - - - 5.2A per Contact
SQW-108-01-L-D-VS-LC-P

SQW-108-01-L-D-VS-LC-P

CONN RCPT 16POS 0.079 GOLD SMD

Samtec Inc.

0 -
SQW-108-01-L-D-VS-LC-P 数据表 SQW Tube Active Receptacle Forked Board to Board or Cable 16 All 0.079" (2.00mm) 2 0.079" (2.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.300" (7.62mm) - -55°C ~ 125°C UL94 V-0 - - Board Lock, Pick and Place 3.8A per Contact
ESQ-105-12-S-D-008

ESQ-105-12-S-D-008

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-105-12-S-D-008 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 10 9 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
HLE-104-02-G-DV-LC

HLE-104-02-G-DV-LC

CONN RCPT 8POS 0.1 GOLD SMD

Samtec Inc.

0 -
HLE-104-02-G-DV-LC 数据表 HLE Tube Active Receptacle Female Socket Board to Board 8 All 0.100" (2.54mm) 2 0.100" (2.54mm) Surface Mount Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.144" (3.66mm) - -55°C ~ 125°C - - - Board Lock 4.1A per Contact
ESW-105-24-G-D

ESW-105-24-G-D

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-105-24-G-D 数据表 ESW Tube Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
HLE-103-02-S-DV-BE-LC-K

HLE-103-02-S-DV-BE-LC-K

CONN RCPT 6POS 0.1 GOLD SMD

Samtec Inc.

0 -
HLE-103-02-S-DV-BE-LC-K 数据表 HLE Tube Active Receptacle, Bottom Entry Female Socket Board to Board 6 All 0.100" (2.54mm) 2 0.100" (2.54mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.144" (3.66mm) - -55°C ~ 125°C - - - Board Lock, Pick and Place 4.1A per Contact
ESQ-110-13-S-S

ESQ-110-13-S-S

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-110-13-S-S 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESW-109-34-G-S-LL

ESW-109-34-G-S-LL

CONN SOCKET 9POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-109-34-G-S-LL 数据表 ESW Bulk Active Elevated Socket Forked Board to Board 9 All 0.100" (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635" (16.13mm) 0.280" (7.11mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESW-108-23-G-D-LL

ESW-108-23-G-D-LL

CONN SOCKET 16POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-108-23-G-D-LL 数据表 ESW Tube Active Elevated Socket Forked Board to Board 16 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESQ-112-12-T-D

ESQ-112-12-T-D

CONN SOCKET 24POS 0.1 TIN PCB

Samtec Inc.

0 -
ESQ-112-12-T-D 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 24 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 - - - 5.7A per Contact
ESW-116-13-T-D

ESW-116-13-T-D

CONN SOCKET 32POS 0.1 TIN PCB

Samtec Inc.

0 -
ESW-116-13-T-D 数据表 ESW Tube Active Elevated Socket Forked Board to Board 32 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 105°C UL94 V-0 - - - 5.2A per Contact
ESQ-125-13-T-S

ESQ-125-13-T-S

CONN SOCKET 25POS 0.1 TIN PCB

Samtec Inc.

0 -
ESQ-125-13-T-S 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 25 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 105°C UL94 V-0 - - - 5.7A per Contact
ESW-120-23-T-S

ESW-120-23-T-S

CONN SOCKET 20POS 0.1 TIN PCB

Samtec Inc.

0 -
ESW-120-23-T-S 数据表 ESW Tube Active Elevated Socket Forked Board to Board 20 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 105°C UL94 V-0 - - - 5.2A per Contact
ESW-126-23-T-S

ESW-126-23-T-S

CONN SOCKET 26POS 0.1 TIN PCB

Samtec Inc.

0 -
ESW-126-23-T-S 数据表 ESW Tube Active Elevated Socket Forked Board to Board 26 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 105°C UL94 V-0 - - - 5.2A per Contact
ESQ-110-44-L-S

ESQ-110-44-L-S

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-110-44-L-S 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.735" (18.67mm) 0.180" (4.57mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
CES-124-01-S-S

CES-124-01-S-S

CONN RCPT 24POS 0.1 GOLD PCB

Samtec Inc.

84 -
CES-124-01-S-S 数据表 CES Bulk Active Receptacle Female Socket Board to Board 24 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.200" (5.08mm) 0.128" (3.25mm) -55°C ~ 125°C UL94 V-0 - - - -
ESQ-109-24-G-S

ESQ-109-24-G-S

CONN SOCKET 9POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-109-24-G-S 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 9 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
CLP-116-02-S-D-A

CLP-116-02-S-D-A

CONN RCPT 32POS 0.05 GOLD SMD

Samtec Inc.

61 -
CLP-116-02-S-D-A 数据表 CLP Tube Active Receptacle Female Socket Board to Board 32 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - Board Guide 3.3A per Contact
ESQ-110-49-L-S

ESQ-110-49-L-S

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-110-49-L-S 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESQ-115-14-L-S

ESQ-115-14-L-S

CONN SOCKET 15POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-115-14-L-S 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 15 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435" (11.05mm) 0.480" (12.19mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
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