排针、插座、母插座

制造商 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值
ESW-114-14-G-S-LL

ESW-114-14-G-S-LL

CONN SOCKET 14POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-114-14-G-S-LL 数据表 ESW Tube Active Elevated Socket Forked Board to Board 14 All 0.100" (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435" (11.05mm) 0.480" (12.19mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESQ-115-23-T-D

ESQ-115-23-T-D

CONN SOCKET 30POS 0.1 TIN PCB

Samtec Inc.

0 -
ESQ-115-23-T-D 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 30 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 105°C UL94 V-0 - - - 5.7A per Contact
ESQ-119-12-L-S

ESQ-119-12-L-S

CONN SOCKET 19POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-119-12-L-S 数据表 ESQ Bulk Active Elevated Socket Forked Board to Board 19 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
HLE-108-02-G-DV-P

HLE-108-02-G-DV-P

CONN RCPT 16POS 0.1 GOLD SMD

Samtec Inc.

0 -
HLE-108-02-G-DV-P 数据表 HLE Tube Active Receptacle Female Socket Board to Board 16 All 0.100" (2.54mm) 2 0.100" (2.54mm) Surface Mount Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.144" (3.66mm) - -55°C ~ 125°C - - - Pick and Place 4.1A per Contact
ESQ-105-69-L-D

ESQ-105-69-L-D

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-105-69-L-D 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.735" (18.67mm) 0.180" (4.57mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESW-112-14-T-D

ESW-112-14-T-D

CONN SOCKET 24POS 0.1 TIN PCB

Samtec Inc.

0 -
ESW-112-14-T-D 数据表 ESW Tube Active Elevated Socket Forked Board to Board 24 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.480" (12.19mm) -55°C ~ 105°C UL94 V-0 - - - 5.2A per Contact
ESQ-112-34-G-S

ESQ-112-34-G-S

CONN SOCKET 12POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-112-34-G-S 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 12 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635" (16.13mm) 0.280" (7.11mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESQ-111-44-S-S

ESQ-111-44-S-S

CONN SOCKET 11POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-111-44-S-S 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 11 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.735" (18.67mm) 0.180" (4.57mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESW-117-12-G-S

ESW-117-12-G-S

CONN SOCKET 17POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-117-12-G-S 数据表 ESW Tube Active Elevated Socket Forked Board to Board 17 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESQ-127-13-T-S

ESQ-127-13-T-S

CONN SOCKET 27POS 0.1 TIN PCB

Samtec Inc.

0 -
ESQ-127-13-T-S 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 27 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 105°C UL94 V-0 - - - 5.7A per Contact
MMS-117-01-L-DV

MMS-117-01-L-DV

CONN RCPT 34POS 0.079 GOLD PCB

Samtec Inc.

0 -
MMS-117-01-L-DV 数据表 MMS Bulk Active Receptacle Female Socket Board to Board or Cable 34 All 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.175" (4.45mm) 0.115" (2.92mm) -55°C ~ 125°C - - - - 3.9A per Contact
SQT-132-01-L-S

SQT-132-01-L-S

CONN RCPT 32POS 0.079 GOLD PCB

Samtec Inc.

0 -
SQT-132-01-L-S 数据表 SQT Bulk Active Receptacle Forked Board to Board or Cable 32 All 0.079" (2.00mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.250" (6.35mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.1A per Contact
RSM-110-02-F-D-K

RSM-110-02-F-D-K

CONN RCPT 20POS 0.05 GOLD SMD

Samtec Inc.

0 -
RSM-110-02-F-D-K 数据表 RSM Tube Active Receptacle Female Socket Board to Board 20 All 0.050" (1.27mm) 2 0.100" (2.54mm) Surface Mount Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.240" (6.10mm) - -55°C ~ 125°C UL94 V-0 - - Pick and Place 3.1A per Contact
SQW-109-01-F-D-VS-LC

SQW-109-01-F-D-VS-LC

CONN RCPT 18POS 0.079 GOLD SMD

Samtec Inc.

0 -
SQW-109-01-F-D-VS-LC 数据表 SQW Tube Active Receptacle Forked Board to Board or Cable 18 All 0.079" (2.00mm) 2 0.079" (2.00mm) Surface Mount Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.300" (7.62mm) - -55°C ~ 125°C UL94 V-0 - - Board Lock 3.8A per Contact
SSM-112-L-DV-LC-P

SSM-112-L-DV-LC-P

CONN RCPT 24POS 0.1 GOLD SMD

Samtec Inc.

0 -
SSM-112-L-DV-LC-P 数据表 Tiger Claw™ SSM Tube Active Receptacle, Pass Through Female Socket Board to Board or Cable 24 All 0.100" (2.54mm) 2 0.100" (2.54mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.290" (7.37mm) - -55°C ~ 125°C - - - Board Lock, Pick and Place 5.2A per Contact
ESQ-106-48-S-T

ESQ-106-48-S-T

CONN SOCKET 18POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-106-48-S-T 数据表 ESQ Bulk Active Elevated Socket Forked Board to Board 18 All 0.100" (2.54mm) 3 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESQ-105-14-G-D-LL

ESQ-105-14-G-D-LL

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-105-14-G-D-LL 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435" (11.05mm) 0.480" (12.19mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESW-111-37-L-D

ESW-111-37-L-D

CONN SOCKET 22POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-111-37-L-D 数据表 ESW Tube Active Elevated Socket Forked Board to Board 22 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESW-112-59-G-S

ESW-112-59-G-S

CONN SOCKET 12POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-112-59-G-S 数据表 ESW Tube Active Elevated Socket Forked Board to Board 12 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635" (16.13mm) 0.280" (7.11mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESW-116-13-G-S

ESW-116-13-G-S

CONN SOCKET 16POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-116-13-G-S 数据表 ESW Tube Active Elevated Socket Forked Board to Board 16 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
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