排针、插座、母插座

制造商 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值

全部重置
全部应用
结果
图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值
CLM-109-02-L-D

CLM-109-02-L-D

CONN RCPT 18POS 0.039 GOLD SMD

Samtec Inc.

53 -
CLM-109-02-L-D 数据表 CLM Bulk Active Receptacle Female Socket Board to Board 18 All 0.039" (1.00mm) 2 0.039" (1.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - - 2.8A per Contact
SSM-126-L-SV-LC

SSM-126-L-SV-LC

CONN RCPT 26POS 0.1 GOLD SMD

Samtec Inc.

0 -
SSM-126-L-SV-LC 数据表 Tiger Claw™ SSM Tube Active Receptacle, Pass Through Female Socket Board to Board or Cable 26 All 0.100" (2.54mm) 1 - Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.290" (7.37mm) - -55°C ~ 125°C - - - Board Lock 5.2A per Contact
RSM-115-02-S-S-K

RSM-115-02-S-S-K

CONN RCPT 15POS 0.05 GOLD SMD

Samtec Inc.

0 -
RSM-115-02-S-S-K 数据表 RSM Tube Active Receptacle Female Socket Board to Board 15 All 0.050" (1.27mm) 1 - Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.240" (6.10mm) - -55°C ~ 125°C UL94 V-0 - - Pick and Place 3.1A per Contact
HLE-113-02-L-DV-P

HLE-113-02-L-DV-P

CONN RCPT 26POS 0.1 GOLD SMD

Samtec Inc.

0 -
HLE-113-02-L-DV-P 数据表 HLE Bulk Active Receptacle Female Socket Board to Board 26 All 0.100" (2.54mm) 2 0.100" (2.54mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.144" (3.66mm) - -55°C ~ 125°C - - - Pick and Place 4.1A per Contact
SSM-125-L-SV-BE-LC-K

SSM-125-L-SV-BE-LC-K

CONN RCPT 25POS 0.1 GOLD SMD

Samtec Inc.

0 -
SSM-125-L-SV-BE-LC-K 数据表 Tiger Claw™ SSM Tube Active Receptacle, Bottom Entry Female Socket Board to Board or Cable 25 All 0.100" (2.54mm) 1 - Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.290" (7.37mm) - -55°C ~ 125°C - - - Board Lock, Pick and Place 5.2A per Contact
ESQ-110-49-G-S

ESQ-110-49-G-S

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-110-49-G-S 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESW-109-33-L-D

ESW-109-33-L-D

CONN SOCKET 18POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-109-33-L-D 数据表 ESW Tube Active Elevated Socket Forked Board to Board 18 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESQ-115-14-G-S

ESQ-115-14-G-S

CONN SOCKET 15POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-115-14-G-S 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 15 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435" (11.05mm) 0.480" (12.19mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESQ-113-49-G-S

ESQ-113-49-G-S

CONN SOCKET 13POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-113-49-G-S 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 13 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESW-120-12-T-D-40

ESW-120-12-T-D-40

CONN SOCKET 40POS 0.1 TIN PCB

Samtec Inc.

0 -
ESW-120-12-T-D-40 数据表 ESW Tube Active Elevated Socket Forked Board to Board 40 39 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 - - - 5.2A per Contact
ESW-136-24-T-S

ESW-136-24-T-S

CONN SOCKET 36POS 0.1 TIN PCB

Samtec Inc.

0 -
ESW-136-24-T-S 数据表 ESW Tube Active Elevated Socket Forked Board to Board 36 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 105°C UL94 V-0 - - - 5.2A per Contact
SQT-137-01-L-S

SQT-137-01-L-S

CONN RCPT 37POS 0.079 GOLD PCB

Samtec Inc.

0 -
SQT-137-01-L-S 数据表 SQT Bulk Active Receptacle Forked Board to Board or Cable 37 All 0.079" (2.00mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.250" (6.35mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.1A per Contact
CLM-111-02-F-D-P

CLM-111-02-F-D-P

CONN RCPT 22POS 0.039 GOLD SMD

Samtec Inc.

0 -
CLM-111-02-F-D-P 数据表 CLM Tube Active Receptacle Female Socket Board to Board 22 All 0.039" (1.00mm) 2 0.039" (1.00mm) Surface Mount Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - Pick and Place 2.8A per Contact
ESQ-107-59-S-D

ESQ-107-59-S-D

CONN SOCKET 14POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-107-59-S-D 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 14 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.635" (16.13mm) 0.280" (7.11mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESW-108-59-G-D

ESW-108-59-G-D

CONN SOCKET 16POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESW-108-59-G-D 数据表 ESW Tube Active Elevated Socket Forked Board to Board 16 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635" (16.13mm) 0.280" (7.11mm) -55°C ~ 125°C UL94 V-0 - - - 5.2A per Contact
ESQ-116-44-L-S

ESQ-116-44-L-S

CONN SOCKET 16POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-116-44-L-S 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 16 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.735" (18.67mm) 0.180" (4.57mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
ESQ-132-12-T-S-LL

ESQ-132-12-T-S-LL

CONN SOCKET 32POS 0.1 TIN PCB

Samtec Inc.

0 -
ESQ-132-12-T-S-LL 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 32 All 0.100" (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 - - - 5.7A per Contact
ESQ-118-13-T-D

ESQ-118-13-T-D

CONN SOCKET 36POS 0.1 TIN PCB

Samtec Inc.

0 -
ESQ-118-13-T-D 数据表 ESQ Tube Active Elevated Socket Forked Board to Board 36 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 105°C UL94 V-0 - - - 5.7A per Contact
ESW-132-23-T-S

ESW-132-23-T-S

CONN SOCKET 32POS 0.1 TIN PCB

Samtec Inc.

0 -
ESW-132-23-T-S 数据表 ESW Tube Active Elevated Socket Forked Board to Board 32 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 105°C UL94 V-0 - - - 5.2A per Contact
ESQ-105-23-S-T

ESQ-105-23-S-T

CONN SOCKET 15POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-105-23-S-T 数据表 ESQ Bulk Active Elevated Socket Forked Board to Board 15 All 0.100" (2.54mm) 3 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
深圳市宝利科技有限公司

搜索

深圳市宝利科技有限公司

产品

深圳市宝利科技有限公司

电话

深圳市宝利科技有限公司

用户