排针、插座、母插座

制造商 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值
831-43-047-20-001000

831-43-047-20-001000

CONN RCPT 47P 0.079 GOLD PCB R/A

Mill-Max Manufacturing Corp.

0 -
831-43-047-20-001000

数据表

831 Bulk Active Receptacle Female Socket Board to Board 47 All 0.079" (2.00mm) 1 - Through Hole, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.079" (2.00mm) 0.140" (3.56mm) -55°C ~ 125°C UL94 V-0 - - - 3A
803-43-080-10-004000

803-43-080-10-004000

CONN RCPT 80POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
803-43-080-10-004000

数据表

803 Bulk Active Receptacle Female Socket Board to Board 80 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.272" (6.91mm) 0.118" (3.00mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A
SQT-133-03-F-6

SQT-133-03-F-6

CONN RCPT 198POS 0.079 GOLD PCB

Samtec Inc.

0 -

-

SQT Tube Active Receptacle Forked Board to Board or Cable 198 All 0.079" (2.00mm) 6 0.079" (2.00mm) Through Hole Solder Push-Pull Gold Flash Black 0.250" (6.35mm) 0.208" (5.28mm) -55°C ~ 125°C UL94 V-0 - - - 5.1A per Contact
CLM-136-02-L-D-BE-P

CLM-136-02-L-D-BE-P

LOW PROFILE DUAL-WIPE SOCKET, 1.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
CLM-136-02-L-D-BE-PA

CLM-136-02-L-D-BE-PA

LOW PROFILE DUAL-WIPE SOCKET, 1.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
853-99-080-20-001000

853-99-080-20-001000

CONN RCPT 80POS 0.05 TIN PCB R/A

Mill-Max Manufacturing Corp.

0 -
853-99-080-20-001000

数据表

853 Bulk Active Receptacle Female Socket Board to Board 80 All 0.050" (1.27mm) 2 0.050" (1.27mm) Through Hole, Right Angle Solder Push-Pull Tin-Lead 100.0µin (2.54µm) Black 0.120" (3.05mm) 0.135" (3.43mm) -55°C ~ 125°C UL94 V-0 - - - 3A
FOLC-135-02-SM-Q-K-TR

FOLC-135-02-SM-Q-K-TR

CONN RCPT 140POS 0.05 GOLD SMD

Samtec Inc.

0 -

-

FOURRAY™ FOLC Tape & Reel (TR) Active Receptacle Female Socket Board to Board 140 All 0.050" (1.27mm) 4 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.178" (4.51mm) - -55°C ~ 125°C UL94 V-0 - - Pick and Place 2.6A per Contact
CLP-136-02-LTL-D

CLP-136-02-LTL-D

LOW PROFILE DUAL-WIPE SOCKET, .0

Samtec Inc.

0 -

-

CLP - Active Receptacle Female Socket Board to Board 72 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - - 3.3A per Contact
803-41-090-62-001000

803-41-090-62-001000

CONN RCPT 90POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
803-41-090-62-001000

数据表

803 Bulk Active Receptacle Female Socket Board to Board 90 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Press-Fit, Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.276" (7.00mm) 0.143" (3.63mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A
803-91-090-62-001000

803-91-090-62-001000

CONN RCPT 90POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
803-91-090-62-001000

数据表

803 Bulk Active Receptacle Female Socket Board to Board 90 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Press-Fit, Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.276" (7.00mm) 0.143" (3.63mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A
YTE-120-02-G-Q-500

YTE-120-02-G-Q-500

2.00 MM FLEXYZ HIGH-DENSITY ELEV

Samtec Inc.

0 -
YTE-120-02-G-Q-500

数据表

YTE Tube Active Elevated Socket Forked Board to Board 80 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.500" (12.70mm) - -55°C ~ 105°C - - - - -
803-83-048-10-216101

803-83-048-10-216101

CONN SOCKET 48POS 0.1 GOLD PCB

Preci-Dip

0 -
803-83-048-10-216101

数据表

803 Bulk Active Socket Female Socket Board to Board 48 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 1.476" (37.50mm) 0.118" (3.00mm) -55°C ~ 125°C UL94 V-0 - - - 3A
CLP-129-02-H-D

CLP-129-02-H-D

LOW PROFILE DUAL-WIPE SOCKET, .0

Samtec Inc.

0 -

-

CLP - Active Receptacle Female Socket Board to Board 58 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - - 3.3A per Contact
CLT-131-02-SM-D-A

CLT-131-02-SM-D-A

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
831-41-039-20-001000

831-41-039-20-001000

CONN RCPT 39P 0.079 GOLD PCB R/A

Mill-Max Manufacturing Corp.

0 -
831-41-039-20-001000

数据表

831 Bulk Active Receptacle Female Socket Board to Board 39 All 0.079" (2.00mm) 1 - Through Hole, Right Angle Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.079" (2.00mm) 0.140" (3.56mm) -55°C ~ 125°C UL94 V-0 - - - 3A
324-13-147-41-002000

324-13-147-41-002000

CONN RCPT 47POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
324-13-147-41-002000

数据表

324 Bulk Active Receptacle Female Socket Board to Board 47 All 0.100" (2.54mm) 1 - Through Hole Wire Wrap Push-Pull Gold 30.0µin (0.76µm) Black 0.110" (2.79mm) 0.630" (16.00mm) -55°C ~ 125°C - - - - 3A
534974-3

534974-3

CONN RCPT 72POS 0.1 GOLD PCB R/A

TE Connectivity AMP Connectors

0 -
534974-3

数据表

AMPMODU Mod II Tube Active Receptacle Female Socket Board to Board 72 All 0.100" (2.54mm) 3 0.100" (2.54mm) Through Hole, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) - 0.338" (8.59mm) 0.115" (2.92mm) - - - - Guide Pin Ears -
YTS-132-01-L-5

YTS-132-01-L-5

2.00 MM FLEXYZ HIGH-DENSITY SOCK

Samtec Inc.

0 -
YTS-132-01-L-5

数据表

YTS Tube Active Socket Forked Board to Board 160 All 0.079" (2.00mm) 5 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.250" (6.35mm) 0.090" (2.29mm) -55°C ~ 125°C - - - - -
YTE-125-02-L-Q-800

YTE-125-02-L-Q-800

2.00 MM FLEXYZ HIGH-DENSITY ELEV

Samtec Inc.

0 -
YTE-125-02-L-Q-800

数据表

YTE Tube Active Elevated Socket Forked Board to Board 100 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.800" (20.32mm) - -55°C ~ 105°C - - - - -
YTE-120-02-L-5-700

YTE-120-02-L-5-700

2.00 MM FLEXYZ HIGH-DENSITY ELEV

Samtec Inc.

0 -
YTE-120-02-L-5-700

数据表

YTE Tube Active Elevated Socket Forked Board to Board 100 All 0.079" (2.00mm) 5 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.700" (17.78mm) - -55°C ~ 105°C - - - - -
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