排针、插座、母插座

制造商 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值
801-13-044-10-007000

801-13-044-10-007000

CONN RCPT 44POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
801-13-044-10-007000

数据表

801 Bulk Active Receptacle Female Socket Board to Board 44 All 0.100" (2.54mm) 1 - Through Hole Solder Cup Push-Pull Gold 30.0µin (0.76µm) Black 0.110" (2.79mm) 0.340" (8.64mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A
ESD-118-G-03

ESD-118-G-03

CONN SOCKET 36POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESD-118-G-03

数据表

ESD Bulk Active Elevated Socket Female Socket Board to Board 36 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.300" (7.62mm) 0.153" (3.89mm) -55°C ~ 125°C UL94 V-0 - - - -
CLP-128-02-H-D-BE

CLP-128-02-H-D-BE

LOW PROFILE DUAL-WIPE SOCKET, .0

Samtec Inc.

0 -

-

CLP - Active Receptacle, Bottom Entry Female Socket Board to Board 56 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - - 3.3A per Contact
CLT-144-02-S-D-P

CLT-144-02-S-D-P

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
CLM-131-02-G-D-PA

CLM-131-02-G-D-PA

LOW PROFILE DUAL-WIPE SOCKET, 1.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
803-41-098-62-001000

803-41-098-62-001000

CONN RCPT 98POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
803-41-098-62-001000

数据表

803 Bulk Active Receptacle Female Socket Board to Board 98 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Press-Fit, Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.276" (7.00mm) 0.143" (3.63mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A
803-91-098-62-001000

803-91-098-62-001000

CONN RCPT 98POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
803-91-098-62-001000

数据表

803 Bulk Active Receptacle Female Socket Board to Board 98 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Press-Fit, Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.276" (7.00mm) 0.143" (3.63mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A
803-91-086-61-001000

803-91-086-61-001000

CONN RCPT 86POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -

-

803 Bulk Active Receptacle Female Socket Board to Board 86 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Press-Fit, Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.276" (7.00mm) 0.104" (2.64mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A
CLT-133-02-SM-D-A

CLT-133-02-SM-D-A

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
CLT-145-02-LM-D-BE-A

CLT-145-02-LM-D-BE-A

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
CLT-150-02-LM-D-BE-A

CLT-150-02-LM-D-BE-A

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
833-13-076-10-002000

833-13-076-10-002000

CONN RCPT 76POS 0.079 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
833-13-076-10-002000

数据表

833 Bulk Active Receptacle Female Socket Board to Board 76 All 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.179" (4.55mm) 0.111" (2.82mm) -55°C ~ 125°C UL94 V-0 - - - 3A
BCS-145-F-D-DE-BE

BCS-145-F-D-DE-BE

PASS-THROUGH SOCKET STRIP, 0.100

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
CLT-119-02-H-D-BE

CLT-119-02-H-D-BE

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
CLP-146-02-F-DH-A

CLP-146-02-F-DH-A

LOW PROFILE DUAL-WIPE SOCKET, .0

Samtec Inc.

0 -

-

CLP - Active Receptacle Female Socket Board to Board 92 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount, Right Angle Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.135" (3.43mm) - -55°C ~ 125°C UL94 V-0 - - Board Guide 3.3A per Contact
329-43-159-41-540000

329-43-159-41-540000

CONN RCPT 59POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
329-43-159-41-540000

数据表

329 Bulk Active Receptacle Female Socket Board to Board 59 All 0.100" (2.54mm) 1 - Through Hole Solder Cup Push-Pull Gold 30.0µin (0.76µm) Black 0.110" (2.79mm) 0.180" (4.57mm) -55°C ~ 125°C UL94 V-0 - - - 3A
803-43-070-61-001000

803-43-070-61-001000

CONN RCPT 70POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -

-

803 Bulk Active Receptacle Female Socket Board to Board 70 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Press-Fit, Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.276" (7.00mm) 0.104" (2.64mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A
803-93-070-61-001000

803-93-070-61-001000

CONN RCPT 70POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -

-

803 Bulk Active Receptacle Female Socket Board to Board 70 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Press-Fit, Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.276" (7.00mm) 0.104" (2.64mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A
ESQT-139-02-G-T-639

ESQT-139-02-G-T-639

CONN SOCKET 117P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 117 All 0.079" (2.00mm) 3 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.639" (16.23mm) 0.211" (5.35mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-139-02-G-T-693

ESQT-139-02-G-T-693

CONN SOCKET 117P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 117 All 0.079" (2.00mm) 3 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.693" (17.60mm) 0.157" (4.00mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
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