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制造商 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值
CLP-134-02-SM-D-PA

CLP-134-02-SM-D-PA

LOW PROFILE DUAL-WIPE SOCKET, .0

Samtec Inc.

0 -

-

CLP - Active Receptacle Female Socket Board to Board 68 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - Board Guide, Pick and Place 3.3A per Contact
803-83-056-10-216101

803-83-056-10-216101

CONN SOCKET 56POS 0.1 GOLD PCB

Preci-Dip

0 -
803-83-056-10-216101

数据表

803 Bulk Active Socket Female Socket Board to Board 56 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 1.476" (37.50mm) 0.118" (3.00mm) -55°C ~ 125°C UL94 V-0 - - - 3A
CLT-149-02-LM-D-BE-A-K

CLT-149-02-LM-D-BE-A-K

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
CLT-122-02-H-D-A-K

CLT-122-02-H-D-A-K

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
399-41-045-21-300000

399-41-045-21-300000

STANDARD SOCKET HEADER

Mill-Max Manufacturing Corp.

0 -

-

399 Bulk Active Socket Female Socket Board to Board 45 All 0.050" (1.27mm) 1 - Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.118" (3.00mm) - -55°C ~ 125°C UL94 V-0 - - Block Terminals 3A
CLT-133-02-SM-D-BE-A

CLT-133-02-SM-D-BE-A

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
BCS-126-H-D-DE-BE

BCS-126-H-D-DE-BE

PASS-THROUGH SOCKET STRIP, 0.100

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
CLT-144-02-S-D-BE-P

CLT-144-02-S-D-BE-P

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
CLP-140-02-STL-D

CLP-140-02-STL-D

LOW PROFILE DUAL-WIPE SOCKET, .0

Samtec Inc.

0 -

-

CLP - Active Receptacle Female Socket Board to Board 80 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - - 3.3A per Contact
CLE-175-01-G-DV

CLE-175-01-G-DV

CONN RCPT 150POS 0.031 GOLD SMD

Samtec Inc.

0 -
CLE-175-01-G-DV

数据表

CLE Bulk Active Receptacle, Pass Through Female Socket Board to Board 150 All 0.031" (0.80mm) 2 0.047" (1.20mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.130" (3.30mm) - -55°C ~ 125°C UL94 V-0 - - - 2.7A per Contact
YTE-130-03-F-5-375

YTE-130-03-F-5-375

2.00 MM FLEXYZ HIGH-DENSITY ELEV

Samtec Inc.

0 -
YTE-130-03-F-5-375

数据表

YTE Tube Active Elevated Socket Forked Board to Board 150 All 0.079" (2.00mm) 5 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.375" (9.53mm) - -55°C ~ 105°C - - - - -
YTQ-124-03-L-6

YTQ-124-03-L-6

2.00 MM FLEXYZ HIGH-DENSITY SQUA

Samtec Inc.

0 -
YTQ-124-03-L-6

数据表

YTQ Tube Active Socket Forked Board to Board 144 All 0.079" (2.00mm) 6 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.250" (6.35mm) 0.208" (5.28mm) -55°C ~ 125°C - - - - -
YTE-130-03-L-Q-368

YTE-130-03-L-Q-368

2.00 MM FLEXYZ HIGH-DENSITY ELEV

Samtec Inc.

0 -
YTE-130-03-L-Q-368

数据表

YTE Tube Active Elevated Socket Forked Board to Board 120 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.368" (9.35mm) - -55°C ~ 105°C - - - - -
YTE-120-03-L-6-408

YTE-120-03-L-6-408

2.00 MM FLEXYZ HIGH-DENSITY ELEV

Samtec Inc.

0 -
YTE-120-03-L-6-408

数据表

YTE Tube Active Elevated Socket Forked Board to Board 120 All 0.079" (2.00mm) 6 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.408" (10.36mm) - -55°C ~ 105°C - - - - -
YTQ-136-03-L-Q

YTQ-136-03-L-Q

2.00 MM FLEXYZ HIGH-DENSITY SQUA

Samtec Inc.

0 -
YTQ-136-03-L-Q

数据表

YTQ Tube Active Socket Forked Board to Board 144 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.250" (6.35mm) 0.208" (5.28mm) -55°C ~ 125°C - - - - -
324-13-158-41-002000

324-13-158-41-002000

CONN RCPT 58POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
324-13-158-41-002000

数据表

324 Bulk Active Receptacle Female Socket Board to Board 58 All 0.100" (2.54mm) 1 - Through Hole Wire Wrap Push-Pull Gold 30.0µin (0.76µm) Black 0.110" (2.79mm) 0.630" (16.00mm) -55°C ~ 125°C - - - - 3A
801-13-050-10-007000

801-13-050-10-007000

CONN RCPT 50POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
801-13-050-10-007000

数据表

801 Bulk Active Receptacle Female Socket Board to Board 50 All 0.100" (2.54mm) 1 - Through Hole Solder Cup Push-Pull Gold 30.0µin (0.76µm) Black 0.110" (2.79mm) 0.340" (8.64mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A
CLT-135-02-S-D-BE-K

CLT-135-02-S-D-BE-K

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
CLT-149-02-FM-D-BE-P

CLT-149-02-FM-D-BE-P

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
ESQ-126-49-S-T

ESQ-126-49-S-T

CONN SOCKET 78POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-126-49-S-T

数据表

ESQ Bulk Active Elevated Socket Forked Board to Board 78 All 0.100" (2.54mm) 3 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
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