排针、插座、母插座

制造商 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值
CLT-142-02-LM-D-BE-K

CLT-142-02-LM-D-BE-K

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
ESD-120-G-08

ESD-120-G-08

CONN SOCKET 40POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESD-120-G-08

数据表

ESD Bulk Active Elevated Socket Female Socket Board to Board 40 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.300" (7.62mm) 0.365" (9.27mm) -55°C ~ 125°C UL94 V-0 - - - -
801-13-054-10-007000

801-13-054-10-007000

CONN RCPT 54POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
801-13-054-10-007000

数据表

801 Bulk Active Receptacle Female Socket Board to Board 54 All 0.100" (2.54mm) 1 - Through Hole Solder Cup Push-Pull Gold 30.0µin (0.76µm) Black 0.110" (2.79mm) 0.340" (8.64mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A
CLP-132-02-H-D-BE-A

CLP-132-02-H-D-BE-A

LOW PROFILE DUAL-WIPE SOCKET, .0

Samtec Inc.

0 -

-

CLP - Active Receptacle, Bottom Entry Female Socket Board to Board 64 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - Board Guide 3.3A per Contact
BCS-130-H-D-PE-001

BCS-130-H-D-PE-001

PASS-THROUGH SOCKET STRIP, 0.100

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
BCS-130-H-D-PE-002

BCS-130-H-D-PE-002

PASS-THROUGH SOCKET STRIP, 0.100

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
CLT-130-02-SM-D-A-K

CLT-130-02-SM-D-A-K

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
M55302/64-B20F

M55302/64-B20F

INTERCONNECT INTERFACE

AirBorn, Inc.

0 -
M55302/64-B20F

数据表

W Bulk Active Receptacle Female Socket Board to Board 20 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold - Gray 0.335" (8.51mm) 0.140" (3.56mm) -65°C ~ 125°C - - - Jackscrews 5A
CLT-127-02-SM-D-BE-A-P

CLT-127-02-SM-D-BE-A-P

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
329-13-159-41-540000

329-13-159-41-540000

CONN RCPT 59POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
329-13-159-41-540000

数据表

329 Bulk Active Receptacle Female Socket Board to Board 59 All 0.100" (2.54mm) 1 - Through Hole Solder Cup Push-Pull Gold 30.0µin (0.76µm) Black 0.110" (2.79mm) 0.180" (4.57mm) -55°C ~ 125°C UL94 V-0 - - - 3A
CLT-141-02-LM-D-BE-A-K

CLT-141-02-LM-D-BE-A-K

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
803-93-098-20-001000

803-93-098-20-001000

CONN RCPT 98POS 0.1 GOLD PCB R/A

Mill-Max Manufacturing Corp.

0 -
803-93-098-20-001000

数据表

803 Bulk Active Receptacle Female Socket Board to Board 98 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.200" (5.08mm) 0.126" (3.20mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A
833-43-072-20-001000

833-43-072-20-001000

CONN RCPT 72P 0.079 GOLD PCB R/A

Mill-Max Manufacturing Corp.

0 -
833-43-072-20-001000

数据表

833 Bulk Active Receptacle Female Socket Board to Board 72 All 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.157" (4.00mm) 0.140" (3.56mm) -55°C ~ 125°C UL94 V-0 - - - 3A
ESD-118-G-27

ESD-118-G-27

CONN SOCKET 36POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESD-118-G-27

数据表

ESD Bulk Active Elevated Socket Female Socket Board to Board 36 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.400" (10.16mm) 0.265" (6.73mm) -55°C ~ 125°C UL94 V-0 - - - -
CLP-136-02-H-D

CLP-136-02-H-D

LOW PROFILE DUAL-WIPE SOCKET, .0

Samtec Inc.

0 -

-

CLP - Active Receptacle Female Socket Board to Board 72 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - - 3.3A per Contact
CLT-138-02-SM-D-A-P

CLT-138-02-SM-D-A-P

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
CLT-137-02-S-D-BE-P

CLT-137-02-S-D-BE-P

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
CLT-127-02-H-D-BE-A-P

CLT-127-02-H-D-BE-A-P

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
PESC-04-40-04-01-S-RA-SD

PESC-04-40-04-01-S-RA-SD

.100" POWERSTRIP/40 A SIGNAL/POW

Samtec Inc.

0 -
PESC-04-40-04-01-S-RA-SD

数据表

PowerStrip™ 40 PESC Tray Active Receptacle Female Socket Board to Board 48 (40 + 8 Power) All - 4 - Through Hole, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.472" (12.00mm) 0.097" (2.47mm) -55°C ~ 105°C - - - Threaded Insert -
PESC-04-40-04-01-S-RA

PESC-04-40-04-01-S-RA

.100" POWERSTRIP/40 A SIGNAL/POW

Samtec Inc.

0 -
PESC-04-40-04-01-S-RA

数据表

PowerStrip™ 40 PESC Tray Active Receptacle Female Socket Board to Board 48 (40 + 8 Power) All - 4 - Through Hole, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.472" (12.00mm) 0.097" (2.47mm) -55°C ~ 105°C - - - - -
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