排针、插座、母插座

制造商 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值
CLM-137-02-L-D-BE

CLM-137-02-L-D-BE

LOW PROFILE DUAL-WIPE SOCKET, 1.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
329-13-161-41-540000

329-13-161-41-540000

CONN RCPT 61POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
329-13-161-41-540000

数据表

329 Bulk Active Receptacle Female Socket Board to Board 61 All 0.100" (2.54mm) 1 - Through Hole Solder Cup Push-Pull Gold 30.0µin (0.76µm) Black 0.110" (2.79mm) 0.180" (4.57mm) -55°C ~ 125°C UL94 V-0 - - - 3A
CLT-148-02-S-D-BE-P

CLT-148-02-S-D-BE-P

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
399-91-046-21-300000

399-91-046-21-300000

STANDARD SOCKET HEADER

Mill-Max Manufacturing Corp.

0 -

-

399 Bulk Active Socket Female Socket Board to Board 46 All 0.050" (1.27mm) 1 - Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.118" (3.00mm) - -55°C ~ 125°C UL94 V-0 - - Block Terminals 3A
WT20SAD9

WT20SAD9

MOTORS & SOLENOIDS

AirBorn, Inc.

0 -
WT20SAD9

数据表

W Bulk Active Receptacle Female Socket Board to Board 20 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold - Gray 0.335" (8.51mm) 0.140" (3.56mm) -65°C ~ 125°C - - - - 5A
ESD-125-G-07

ESD-125-G-07

CONN SOCKET 50POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESD-125-G-07

数据表

ESD Bulk Active Elevated Socket Female Socket Board to Board 50 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.400" (10.16mm) 0.265" (6.73mm) -55°C ~ 125°C UL94 V-0 - - - -
CLP-133-02-H-D-BE-P

CLP-133-02-H-D-BE-P

LOW PROFILE DUAL-WIPE SOCKET, .0

Samtec Inc.

0 -

-

CLP - Active Receptacle, Bottom Entry Female Socket Board to Board 66 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - Pick and Place 3.3A per Contact
YTE-132-02-L-Q-500-001

YTE-132-02-L-Q-500-001

2.00 MM FLEXYZ HIGH-DENSITY ELEV

Samtec Inc.

0 -
YTE-132-02-L-Q-500-001

数据表

YTE Tube Active Elevated Socket Forked Board to Board 128 127 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.500" (12.70mm) - -55°C ~ 105°C - - - - -
CLT-131-02-H-D-A

CLT-131-02-H-D-A

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
ESQT-136-03-G-Q-310

ESQT-136-03-G-Q-310

CONN SOCKET 144P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 144 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.310" (7.87mm) 0.148" (3.76mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-136-03-G-Q-368

ESQT-136-03-G-Q-368

CONN SOCKET 144P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 144 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.368" (9.35mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-136-03-G-Q-370

ESQT-136-03-G-Q-370

CONN SOCKET 144P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 144 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.370" (9.40mm) 0.088" (2.23mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-136-03-G-Q-408

ESQT-136-03-G-Q-408

CONN SOCKET 144P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 144 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.408" (10.36mm) 0.050" (1.27mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
801-13-056-10-007000

801-13-056-10-007000

CONN RCPT 56POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

0 -
801-13-056-10-007000

数据表

801 Bulk Active Receptacle Female Socket Board to Board 56 All 0.100" (2.54mm) 1 - Through Hole Solder Cup Push-Pull Gold 30.0µin (0.76µm) Black 0.110" (2.79mm) 0.340" (8.64mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A
CLT-139-02-SM-D-A-P

CLT-139-02-SM-D-A-P

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
CLM-120-02-H-D-A-P

CLM-120-02-H-D-A-P

LOW PROFILE DUAL-WIPE SOCKET, 1.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
ESD-132-T-07

ESD-132-T-07

CONN SOCKET 64POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESD-132-T-07

数据表

ESD Bulk Active Elevated Socket Female Socket Board to Board 64 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.400" (10.16mm) 0.265" (6.73mm) -55°C ~ 125°C UL94 V-0 - - - -
803-83-068-10-216101

803-83-068-10-216101

CONN SOCKET 68POS 0.1 GOLD PCB

Preci-Dip

0 -
803-83-068-10-216101

数据表

803 Bulk Active Socket Female Socket Board to Board 68 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 1.476" (37.50mm) 0.118" (3.00mm) -55°C ~ 125°C UL94 V-0 - - - 3A
CLP-134-02-STL-D-PA

CLP-134-02-STL-D-PA

LOW PROFILE DUAL-WIPE SOCKET, .0

Samtec Inc.

0 -

-

CLP - Active Receptacle Female Socket Board to Board 68 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - Board Guide, Pick and Place 3.3A per Contact
CLP-134-02-STL-D-P

CLP-134-02-STL-D-P

LOW PROFILE DUAL-WIPE SOCKET, .0

Samtec Inc.

0 -

-

CLP - Active Receptacle Female Socket Board to Board 68 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - Pick and Place 3.3A per Contact
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