排针、插座、母插座

制造商 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值
CLT-138-02-SM-D-BE

CLT-138-02-SM-D-BE

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
CLP-150-02-STL-D

CLP-150-02-STL-D

LOW PROFILE DUAL-WIPE SOCKET, .0

Samtec Inc.

0 -

-

CLP - Active Receptacle Female Socket Board to Board 100 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - - 3.3A per Contact
CLP-145-02-STL-D

CLP-145-02-STL-D

LOW PROFILE DUAL-WIPE SOCKET, .0

Samtec Inc.

0 -

-

CLP - Active Receptacle Female Socket Board to Board 90 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - - 3.3A per Contact
ESQT-140-02-S-Q-652

ESQT-140-02-S-Q-652

CONN SOCKET 160P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 160 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.652" (16.56mm) 0.198" (5.03mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-140-02-S-Q-665

ESQT-140-02-S-Q-665

CONN SOCKET 160P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 160 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.665" (16.90mm) 0.185" (4.70mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-140-02-S-Q-722

ESQT-140-02-S-Q-722

CONN SOCKET 160P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 160 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.722" (18.34mm) 0.128" (3.25mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-140-02-S-Q-760

ESQT-140-02-S-Q-760

CONN SOCKET 160P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 160 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.760" (19.30mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
399-91-048-21-300000

399-91-048-21-300000

STANDARD SOCKET HEADER

Mill-Max Manufacturing Corp.

0 -

-

399 Bulk Active Socket Female Socket Board to Board 48 All 0.050" (1.27mm) 1 - Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.118" (3.00mm) - -55°C ~ 125°C UL94 V-0 - - Block Terminals 3A
FOLC-120-M2-S-Q-LC

FOLC-120-M2-S-Q-LC

CONN RCPT 80P 0.05 GOLD SMD T/H

Samtec Inc.

0 -

-

FOURRAY™ FOLC Tube Active Receptacle Female Socket Board to Board 80 All 0.050" (1.27mm) 4 0.050" (1.27mm) Surface Mount, Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.185" (4.70mm) 0.120" (3.05mm) -55°C ~ 125°C UL94 V-0 - - Board Lock 2.6A per Contact
YTQ-138-02-G-Q

YTQ-138-02-G-Q

2.00 MM FLEXYZ HIGH-DENSITY SQUA

Samtec Inc.

0 -
YTQ-138-02-G-Q

数据表

YTQ Tube Active Socket Forked Board to Board 152 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.250" (6.35mm) 0.600" (15.24mm) -55°C ~ 125°C - - - - -
CLT-137-02-SM-D-BE-A-K

CLT-137-02-SM-D-BE-A-K

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
FOLC-145-02-S-Q-P-TR

FOLC-145-02-S-Q-P-TR

CONN RCPT 180POS 0.05 GOLD SMD

Samtec Inc.

0 -

-

FOURRAY™ FOLC Tape & Reel (TR) Active Receptacle Female Socket Board to Board 180 All 0.050" (1.27mm) 4 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.178" (4.51mm) - -55°C ~ 125°C UL94 V-0 - - Pick and Place 2.6A per Contact
853-13-082-10-003000

853-13-082-10-003000

STANDARD SOCKET HEADER

Mill-Max Manufacturing Corp.

0 -

-

853 Bulk Active Socket Female Socket Board to Board 82 All 0.050" (1.27mm) 2 0.050" (1.27mm) Through Hole Solder Cup Push-Pull Gold 3.00µin (0.076µm) Black 0.149" (3.78mm) 0.191" (4.85mm) -55°C ~ 125°C UL94 V-0 - - - 3A
FOLC-125-L1-S-Q-LC

FOLC-125-L1-S-Q-LC

CONN RCPT 100POS 0.05 GOLD PCB

Samtec Inc.

0 -

-

FOURRAY™ FOLC Tube Active Receptacle Female Socket Board to Board 100 All 0.050" (1.27mm) 4 0.050" (1.27mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.180" (4.57mm) 0.075" (1.91mm) -55°C ~ 125°C UL94 V-0 - - Board Lock 2.6A per Contact
833-43-078-20-001000

833-43-078-20-001000

CONN RCPT 78P 0.079 GOLD PCB R/A

Mill-Max Manufacturing Corp.

0 -
833-43-078-20-001000

数据表

833 Bulk Active Receptacle Female Socket Board to Board 78 All 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.157" (4.00mm) 0.140" (3.56mm) -55°C ~ 125°C UL94 V-0 - - - 3A
BCS-132-H-D-DE-032

BCS-132-H-D-DE-032

PASS-THROUGH SOCKET STRIP, 0.100

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
ESQT-120-02-H-6-730

ESQT-120-02-H-6-730

CONN SOCKET 120P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 120 All 0.079" (2.00mm) 6 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.730" (18.54mm) 0.120" (3.05mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
CLT-129-02-H-D-BE-A-K

CLT-129-02-H-D-BE-A-K

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
YTQ-150-01-L-Q

YTQ-150-01-L-Q

2.00 MM FLEXYZ HIGH-DENSITY SQUA

Samtec Inc.

0 -
YTQ-150-01-L-Q

数据表

YTQ Tube Active Socket Forked Board to Board 200 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.250" (6.35mm) 0.090" (2.29mm) -55°C ~ 125°C - - - - -
ESD-130-T-25

ESD-130-T-25

CONN SOCKET 60POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESD-130-T-25

数据表

ESD Bulk Active Elevated Socket Female Socket Board to Board 60 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.500" (12.70mm) 0.165" (4.19mm) -55°C ~ 125°C UL94 V-0 - - - -
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