排针、插座、母插座

制造商 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值
CLT-135-02-H-D-A

CLT-135-02-H-D-A

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
ESD-129-G-23

ESD-129-G-23

CONN SOCKET 58POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESD-129-G-23

数据表

ESD Bulk Active Elevated Socket Female Socket Board to Board 58 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.300" (7.62mm) 0.115" (2.92mm) -55°C ~ 125°C UL94 V-0 - - - -
CLT-145-02-SM-D-P

CLT-145-02-SM-D-P

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
FOLC-130-04-L-Q

FOLC-130-04-L-Q

CONN RCPT 120POS 0.05 GOLD PCB

Samtec Inc.

0 -

-

FOURRAY™ FOLC Tube Active Receptacle Female Socket Board to Board 120 All 0.050" (1.27mm) 4 0.050" (1.27mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.180" (4.57mm) 0.120" (3.05mm) -55°C ~ 125°C UL94 V-0 - - - 2.6A per Contact
BCS-132-H-D-PE-BE

BCS-132-H-D-PE-BE

PASS-THROUGH SOCKET STRIP, 0.100

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
803-83-066-10-216101

803-83-066-10-216101

CONN SOCKET 66POS 0.1 GOLD PCB

Preci-Dip

0 -
803-83-066-10-216101

数据表

803 Bulk Active Socket Female Socket Board to Board 66 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 1.476" (37.50mm) 0.118" (3.00mm) -55°C ~ 125°C UL94 V-0 - - - 3A
ROLC-145-02-S-Q-LC-P-TR

ROLC-145-02-S-Q-LC-P-TR

.050" FOURRAY QUAD ROW SOCKET ST

Samtec Inc.

0 -
ROLC-145-02-S-Q-LC-P-TR

数据表

FOURRAY™ ROLC Tape & Reel (TR) Active Receptacle Female Socket Board to Board 180 All 0.050" (1.27mm) 4 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.175" (4.45mm) - -55°C ~ 125°C - - - Board Lock, Pick and Place -
CLT-132-02-H-D-BE-P

CLT-132-02-H-D-BE-P

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
YTE-137-03-L-Q-355

YTE-137-03-L-Q-355

2.00 MM FLEXYZ HIGH-DENSITY ELEV

Samtec Inc.

0 -
YTE-137-03-L-Q-355

数据表

YTE Tube Active Elevated Socket Forked Board to Board 148 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.355" (9.02mm) - -55°C ~ 105°C - - - - -
ESD-136-T-28

ESD-136-T-28

CONN SOCKET 72POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESD-136-T-28

数据表

ESD Bulk Active Elevated Socket Female Socket Board to Board 72 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.300" (7.62mm) 0.365" (9.27mm) -55°C ~ 125°C UL94 V-0 - - - -
YTE-130-03-M-Q-368-117

YTE-130-03-M-Q-368-117

2.00 MM FLEXYZ HIGH-DENSITY ELEV

Samtec Inc.

0 -
YTE-130-03-M-Q-368-117

数据表

YTE Tube Active Elevated Socket Forked Board to Board 120 119 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.368" (9.35mm) - -55°C ~ 105°C - - - - -
ESQT-150-03-M-Q-310

ESQT-150-03-M-Q-310

CONN SOCKET 200P 0.079 GOLD PCB

Samtec Inc.

0 -
ESQT-150-03-M-Q-310

数据表

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 200 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.310" (7.87mm) 0.148" (3.76mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-150-03-M-Q-340

ESQT-150-03-M-Q-340

CONN SOCKET 200P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 200 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.340" (8.64mm) 0.118" (3.00mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-150-03-M-Q-350

ESQT-150-03-M-Q-350

CONN SOCKET 200P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 200 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.350" (8.89mm) 0.108" (2.75mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-150-03-M-Q-360

ESQT-150-03-M-Q-360

CONN SOCKET 200P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 200 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.360" (9.14mm) 0.098" (2.50mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-150-03-M-Q-365

ESQT-150-03-M-Q-365

CONN SOCKET 200P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 200 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.365" (9.27mm) 0.093" (2.35mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-150-03-M-Q-368

ESQT-150-03-M-Q-368

CONN SOCKET 200P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 200 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.368" (9.35mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-150-03-M-Q-385

ESQT-150-03-M-Q-385

CONN SOCKET 200P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 200 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.385" (9.78mm) 0.073" (1.85mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
BCS-125-H-D-HE

BCS-125-H-D-HE

PASS-THROUGH SOCKET STRIP, 0.100

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
CLT-148-02-LM-D-BE-A-K

CLT-148-02-LM-D-BE-A-K

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
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