排针、插座、母插座

制造商 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值
FOLC-150-02-S-Q-P-TR

FOLC-150-02-S-Q-P-TR

CONN RCPT 200POS 0.05 GOLD SMD

Samtec Inc.

0 -

-

FOURRAY™ FOLC Tape & Reel (TR) Active Receptacle Female Socket Board to Board 200 All 0.050" (1.27mm) 4 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.178" (4.51mm) - -55°C ~ 125°C UL94 V-0 - - Pick and Place 2.6A per Contact
CLT-149-02-LM-D-BE-A-P

CLT-149-02-LM-D-BE-A-P

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
CLP-139-02-H-D-BE

CLP-139-02-H-D-BE

LOW PROFILE DUAL-WIPE SOCKET, .0

Samtec Inc.

0 -

-

CLP - Active Receptacle, Bottom Entry Female Socket Board to Board 78 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - - 3.3A per Contact
FOLC-130-L4-L-Q

FOLC-130-L4-L-Q

CONN RCPT 120POS 0.05 GOLD PCB

Samtec Inc.

0 -

-

FOURRAY™ FOLC Tube Active Receptacle Female Socket Board to Board 120 All 0.050" (1.27mm) 4 0.050" (1.27mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.180" (4.57mm) 0.120" (3.05mm) -55°C ~ 125°C UL94 V-0 - - - 2.6A per Contact
556-003-541-102

556-003-541-102

556 SERIES EDACON CONNECTOR WITH

EDAC Inc.

0 -
556-003-541-102

数据表

556 Bulk Active Receptacle Female Socket Board to Board 3 All 0.156" (3.96mm) 1 - Through Hole Wire Wrap Locking Ramp Gold - White 0.835" (21.21mm) - -40°C ~ 105°C UL94 V-0 - - - 8.5A
556-003-501-102

556-003-501-102

556 SERIES EDACON CONNECTOR WITH

EDAC Inc.

0 -
556-003-501-102

数据表

556 Bulk Active Receptacle Female Socket Board to Board 3 All 0.156" (3.96mm) 1 - Through Hole Solder Locking Ramp Gold - White 0.835" (21.21mm) - -40°C ~ 105°C UL94 V-0 - - - 8.5A
CLT-126-02-H-D-BE-A

CLT-126-02-H-D-BE-A

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
YTE-119-03-G-5-375

YTE-119-03-G-5-375

2.00 MM FLEXYZ HIGH-DENSITY ELEV

Samtec Inc.

0 -
YTE-119-03-G-5-375

数据表

YTE Tube Active Elevated Socket Forked Board to Board 95 All 0.079" (2.00mm) 5 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.375" (9.53mm) - -55°C ~ 105°C - - - - -
ROLC-125-02-SM-Q-LC-K

ROLC-125-02-SM-Q-LC-K

.050" FOURRAY QUAD ROW SOCKET ST

Samtec Inc.

0 -
ROLC-125-02-SM-Q-LC-K

数据表

FOURRAY™ ROLC Tube Active Receptacle Female Socket Board to Board 100 All 0.050" (1.27mm) 4 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.175" (4.45mm) - -55°C ~ 125°C - - - Board Lock, Pick and Place -
SQT-150-01-S-T-RA

SQT-150-01-S-T-RA

CONN RCPT 150P 0.079 GOLD PCB RA

Samtec Inc.

0 -

-

SQT Tube Active Receptacle Forked Board to Board or Cable 150 All 0.079" (2.00mm) 3 0.079" (2.00mm) Through Hole, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.236" (6.00mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 - - - 5.1A per Contact
ESD-136-T-24

ESD-136-T-24

CONN SOCKET 72POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESD-136-T-24

数据表

ESD Bulk Active Elevated Socket Female Socket Board to Board 72 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.400" (10.16mm) 0.115" (2.92mm) -55°C ~ 125°C UL94 V-0 - - - -
G125-FV10805F3-1AB1ABR

G125-FV10805F3-1AB1ABR

8+2 POS. FEMALE VERTICAL THROUGH

Harwin Inc.

0 -

-

- Bulk Active - - - - - - - - - - - - - - - - - - - - - -
ESQT-150-02-M-Q-368

ESQT-150-02-M-Q-368

CONN SOCKET 200P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Bulk Active Elevated Socket Forked Board to Board or Cable 200 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.368" (9.35mm) 0.482" (12.24mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-150-02-M-Q-570

ESQT-150-02-M-Q-570

CONN SOCKET 200P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 200 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.570" (14.48mm) 0.280" (7.11mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-150-02-M-Q-610

ESQT-150-02-M-Q-610

CONN SOCKET 200P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 200 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.610" (15.49mm) 0.240" (6.10mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ROLC-145-L2-S-Q-LC-P-TR

ROLC-145-L2-S-Q-LC-P-TR

.050" FOURRAY QUAD ROW SOCKET ST

Samtec Inc.

0 -
ROLC-145-L2-S-Q-LC-P-TR

数据表

FOURRAY™ ROLC Tape & Reel (TR) Active Receptacle Female Socket Board to Board 180 All 0.050" (1.27mm) 4 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.175" (4.45mm) - -55°C ~ 125°C - - - Board Lock, Pick and Place -
CLT-144-02-S-D-BE-A-K

CLT-144-02-S-D-BE-A-K

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
ROLC-150-02-S-Q-K-TR

ROLC-150-02-S-Q-K-TR

.050" FOURRAY QUAD ROW SOCKET ST

Samtec Inc.

0 -
ROLC-150-02-S-Q-K-TR

数据表

FOURRAY™ ROLC Tape & Reel (TR) Active Receptacle Female Socket Board to Board 200 All 0.050" (1.27mm) 4 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.175" (4.45mm) - -55°C ~ 125°C - - - Pick and Place -
YTQ-145-03-L-Q

YTQ-145-03-L-Q

2.00 MM FLEXYZ HIGH-DENSITY SQUA

Samtec Inc.

0 -
YTQ-145-03-L-Q

数据表

YTQ Tube Active Socket Forked Board to Board 180 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.250" (6.35mm) 0.208" (5.28mm) -55°C ~ 125°C - - - - -
YTE-120-02-G-5-760

YTE-120-02-G-5-760

2.00 MM FLEXYZ HIGH-DENSITY ELEV

Samtec Inc.

0 -
YTE-120-02-G-5-760

数据表

YTE Tube Active Elevated Socket Forked Board to Board 100 All 0.079" (2.00mm) 5 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.760" (19.30mm) - -55°C ~ 105°C - - - - -
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