排针、插座、母插座

制造商 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 样式 位置数量 已加载位置数 配对间距 行数 行间距 - 配对 安装类型 端接方式 固定类型 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 绝缘颜色 绝缘高度 触点长度 - 引脚部分 工作温度 材料阻燃等级 触点表面处理 - 引脚 配对堆叠高度 防护等级 特性 电流额定值(安培) 电压额定值
CLT-134-02-H-D-P

CLT-134-02-H-D-P

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
CLT-143-02-SM-D-A-K

CLT-143-02-SM-D-A-K

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
CLH-144-H-D-DV

CLH-144-H-D-DV

CLH-144-H-D-DV

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
CLP-140-02-H-D-K

CLP-140-02-H-D-K

LOW PROFILE DUAL-WIPE SOCKET, .0

Samtec Inc.

0 -

-

CLP - Active Receptacle Female Socket Board to Board 80 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - Pick and Place 3.3A per Contact
ESQT-135-02-M-6-375

ESQT-135-02-M-6-375

CONN SOCKET 210P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 210 All 0.079" (2.00mm) 6 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.375" (9.53mm) 0.475" (12.07mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQT-135-02-M-6-690

ESQT-135-02-M-6-690

CONN SOCKET 210P 0.079 GOLD PCB

Samtec Inc.

0 -

-

ESQT Tube Active Elevated Socket Forked Board to Board or Cable 210 All 0.079" (2.00mm) 6 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.690" (17.52mm) 0.160" (4.06mm) -55°C ~ 125°C UL94 V-0 - - - 4.5A per Contact
ESQ-133-38-G-T

ESQ-133-38-G-T

CONN SOCKET 99POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESQ-133-38-G-T

数据表

ESQ Tube Active Elevated Socket Forked Board to Board 99 All 0.100" (2.54mm) 3 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 125°C UL94 V-0 - - - 5.7A per Contact
FOLC-135-04-S-Q

FOLC-135-04-S-Q

CONN RCPT 140POS 0.05 GOLD PCB

Samtec Inc.

0 -

-

FOURRAY™ FOLC Tube Active Receptacle Female Socket Board to Board 140 All 0.050" (1.27mm) 4 0.050" (1.27mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.180" (4.57mm) 0.120" (3.05mm) -55°C ~ 125°C UL94 V-0 - - - 2.6A per Contact
534974-8

534974-8

CONN RCPT 150P 0.1 GOLD PCB R/A

TE Connectivity AMP Connectors

0 -
534974-8

数据表

AMPMODU Mod II Tube Active Receptacle Female Socket Board to Board 150 All 0.100" (2.54mm) 3 0.100" (2.54mm) Through Hole, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) - 0.338" (8.59mm) 0.115" (2.92mm) - - - - Guide Pin Ears -
CLT-144-02-SM-D-K

CLT-144-02-SM-D-K

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
CLT-140-02-SM-D-BE-K

CLT-140-02-SM-D-BE-K

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
FOLC-135-M1-L-Q

FOLC-135-M1-L-Q

CONN RCPT 140P 0.05 GOLD SMD T/H

Samtec Inc.

0 -

-

FOURRAY™ FOLC Tube Active Receptacle Female Socket Board to Board 140 All 0.050" (1.27mm) 4 0.050" (1.27mm) Surface Mount, Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.185" (4.70mm) 0.075" (1.91mm) -55°C ~ 125°C UL94 V-0 - - - 2.6A per Contact
CLT-143-02-H-D-P

CLT-143-02-H-D-P

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
YTE-145-03-L-Q-345

YTE-145-03-L-Q-345

2.00 MM FLEXYZ HIGH-DENSITY ELEV

Samtec Inc.

0 -
YTE-145-03-L-Q-345

数据表

YTE Tube Active Elevated Socket Forked Board to Board 180 All 0.079" (2.00mm) 4 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.345" (8.76mm) - -55°C ~ 105°C - - - - -
CLT-131-02-H-D-BE-A

CLT-131-02-H-D-BE-A

LOW PROFILE DUAL WIPE SOCKET, 2.

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - - - - - - - - -
ESD-130-G-03

ESD-130-G-03

CONN SOCKET 60POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESD-130-G-03

数据表

ESD Bulk Active Elevated Socket Female Socket Board to Board 60 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.300" (7.62mm) 0.153" (3.89mm) -55°C ~ 125°C UL94 V-0 - - - -
ESD-128-G-23

ESD-128-G-23

CONN SOCKET 56POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESD-128-G-23

数据表

ESD Bulk Active Elevated Socket Female Socket Board to Board 56 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.300" (7.62mm) 0.115" (2.92mm) -55°C ~ 125°C UL94 V-0 - - - -
CLP-148-02-STL-D

CLP-148-02-STL-D

LOW PROFILE DUAL-WIPE SOCKET, .0

Samtec Inc.

0 -

-

CLP - Active Receptacle Female Socket Board to Board 96 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - - 3.3A per Contact
ESD-126-G-05

ESD-126-G-05

CONN SOCKET 52POS 0.1 GOLD PCB

Samtec Inc.

0 -
ESD-126-G-05

数据表

ESD Bulk Active Elevated Socket Female Socket Board to Board 52 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.500" (12.70mm) 0.165" (4.19mm) -55°C ~ 125°C UL94 V-0 - - - -
CLP-137-02-H-D-BE

CLP-137-02-H-D-BE

LOW PROFILE DUAL-WIPE SOCKET, .0

Samtec Inc.

0 -

-

CLP - Active Receptacle, Bottom Entry Female Socket Board to Board 74 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084" (2.14mm) - -55°C ~ 125°C UL94 V-0 - - - 3.3A per Contact
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