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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
123-87-308-41-001101

123-87-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
123-87-308-41-001101

数据表

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-316-41-605101

110-87-316-41-605101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
110-87-316-41-605101

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-610-41-005101

110-83-610-41-005101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
110-83-610-41-005101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
03-0513-10H

03-0513-10H

CONN SOCKET SIP 3POS GOLD

Aries Electronics

0 -
03-0513-10H

数据表

0513 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
115-87-314-41-001101

115-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
115-87-314-41-001101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ED028PLCZ-SM-N

ED028PLCZ-SM-N

CONN SOCKET PLCC 28POS

On Shore Technology Inc.

0 -
ED028PLCZ-SM-N

数据表

ED Tube Active PLCC 28 (2 x 14) 0.050" (1.27mm) - - Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) - - Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 105°C
822499-1

822499-1

CONN SOCKET PLCC 44POS TIN-LEAD

TE Connectivity AMP Connectors

0 -
822499-1

数据表

- Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin-Lead - Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead - Phosphor Bronze Thermoplastic -
AR 36-HGL-TT

AR 36-HGL-TT

SOCKET

Assmann WSW Components

0 -
AR 36-HGL-TT

数据表

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
DIP328-011B

DIP328-011B

DIP328-011B-DIP SOCKET 28 CTS

Amphenol ICC (FCI)

0 -
DIP328-011B

数据表

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
AR 52-HZL-TT

AR 52-HZL-TT

SOCKET

Assmann WSW Components

0 -
AR 52-HZL-TT

数据表

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
03-0518-11H

03-0518-11H

CONN SOCKET SIP 3POS GOLD

Aries Electronics

0 -
03-0518-11H

数据表

518 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
07-0518-10T

07-0518-10T

CONN SOCKET SIP 7POS GOLD

Aries Electronics

0 -
07-0518-10T

数据表

518 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
08-1518-10

08-1518-10

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-1518-10

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
A40-LCG

A40-LCG

CONN IC DIP SOCKET 40POS GOLD

Assmann WSW Components

0 -
A40-LCG

数据表

- - Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - - Through Hole Open Frame - 0.100" (2.54mm) Gold - - - -
116-83-306-41-012101

116-83-306-41-012101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-83-306-41-012101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-210-31-012101

614-87-210-31-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
614-87-210-31-012101

数据表

614 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-310-31-012101

614-87-310-31-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
614-87-310-31-012101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0102-G-2

HLS-0102-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0102-G-2

数据表

HLS Tube Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
612-83-308-41-001101

612-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
612-83-308-41-001101

数据表

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AW 127-39/Z-T

AW 127-39/Z-T

SOCKET 39 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
AW 127-39/Z-T

数据表

- - Active - - - - - - - - - - - - - - -
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