IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
122-87-316-41-001101

122-87-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
122-87-316-41-001101

数据表

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-422-41-105101

110-87-422-41-105101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
110-87-422-41-105101

数据表

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
130-028-050

130-028-050

CONN IC DIP SOCKET 28POS GOLD

3M

0 -
130-028-050

数据表

100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
110-83-316-41-105101

110-83-316-41-105101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
110-83-316-41-105101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
917-83-108-41-005101

917-83-108-41-005101

CONN TRANSIST TO-5 8POS GOLD

Preci-Dip

0 -
917-83-108-41-005101

数据表

917 Bulk Active Transistor, TO-5 8 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SMPX-44LCC-P

SMPX-44LCC-P

SMT PLCC SOCKET 44P POLARISED RO

Kycon, Inc.

0 -
SMPX-44LCC-P

数据表

SMPX Tube Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -50°C ~ 105°C
HLS-0104-G-2

HLS-0104-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0104-G-2

数据表

HLS Tube Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
540-99-068-17-400000

540-99-068-17-400000

CONN SOCKET PLCC 68POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
540-99-068-17-400000

数据表

540 Tube Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
540-99-068-17-400200

540-99-068-17-400200

CONN SOCKET PLCC 68POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
540-99-068-17-400200

数据表

540 Tube Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
116-83-314-41-003101

116-83-314-41-003101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
116-83-314-41-003101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-318-41-117101

114-83-318-41-117101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
114-83-318-41-117101

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-318-41-134161

114-83-318-41-134161

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
114-83-318-41-134161

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
14-0513-10T

14-0513-10T

CONN SOCKET SIP 14POS GOLD

Aries Electronics

0 -
14-0513-10T

数据表

0513 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
18-0518-10

18-0518-10

CONN SOCKET SIP 18POS GOLD

Aries Electronics

0 -
18-0518-10

数据表

518 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
115-87-428-41-003101

115-87-428-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
115-87-428-41-003101

数据表

115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR28-HZW/T

AR28-HZW/T

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components

0 -
AR28-HZW/T

数据表

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
SIP1X32-001B

SIP1X32-001B

SIP1X32-001B-SIP SOCKET 32 POS

Amphenol ICC (FCI)

0 -
SIP1X32-001B

数据表

SIP1x Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
614-87-320-31-012101

614-87-320-31-012101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
614-87-320-31-012101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-420-31-012101

614-87-420-31-012101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
614-87-420-31-012101

数据表

614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
643644-6

643644-6

CONN SOCKET SIP 12POS TIN

TE Connectivity AMP Connectors

0 -
643644-6

数据表

Diplomate DL Tray Obsolete SIP 12 (1 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
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