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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
116-87-428-41-003101

116-87-428-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
116-87-428-41-003101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-83-628-41-003101

115-83-628-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
115-83-628-41-003101

数据表

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
1814643-8

1814643-8

CONN IC DIP SOCKET 10POS GOLD

TE Connectivity AMP Connectors

0 -
1814643-8

数据表

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass Thermoplastic, Polyester -55°C ~ 125°C
146-87-322-41-035101

146-87-322-41-035101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
146-87-322-41-035101

数据表

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP050-1X28-160B

SIP050-1X28-160B

1X28-160B-SIP SOCKET 28 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X28-160B

数据表

SIP050-1x Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
917-43-108-41-001000

917-43-108-41-001000

CONN TRANSIST TO-5 8POS GOLD

Mill-Max Manufacturing Corp.

0 -
917-43-108-41-001000

数据表

917 Tube Active Transistor, TO-5 8 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
917-43-208-41-001000

917-43-208-41-001000

CONN SOCKET TRANSIST TO-100 8POS

Mill-Max Manufacturing Corp.

0 -
917-43-208-41-001000

数据表

917 Tube Active Transistor, TO-100 8 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-87-420-41-002101

116-87-420-41-002101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
116-87-420-41-002101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
20-0513-10

20-0513-10

CONN SOCKET SIP 20POS GOLD

Aries Electronics

0 -
20-0513-10

数据表

0513 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
22-0513-10T

22-0513-10T

CONN SOCKET SIP 22POS GOLD

Aries Electronics

0 -
22-0513-10T

数据表

0513 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
116-83-318-41-007101

116-83-318-41-007101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
116-83-318-41-007101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0204-T-2

HLS-0204-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0204-T-2

数据表

HLS Tube Active SIP 8 (2 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
114-87-642-41-117101

114-87-642-41-117101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
114-87-642-41-117101

数据表

114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-87-642-41-134161

114-87-642-41-134161

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
114-87-642-41-134161

数据表

114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-322-41-008101

116-87-322-41-008101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
116-87-322-41-008101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
117-83-620-41-105101

117-83-620-41-105101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
117-83-620-41-105101

数据表

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
D01-9951642

D01-9951642

CONN SOCKET SIP 16POS GOLD

Harwin Inc.

0 -
D01-9951642

数据表

D01-995 Tube Obsolete SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-310-41-013101

116-87-310-41-013101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-87-310-41-013101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-312-41-004101

116-83-312-41-004101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
116-83-312-41-004101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-320-41-003101

116-83-320-41-003101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
116-83-320-41-003101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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