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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
30-0518-10

30-0518-10

CONN SOCKET SIP 30POS GOLD

Aries Electronics

0 -
30-0518-10

数据表

518 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
08-0517-90C

08-0517-90C

CONN SOCKET SIP 8POS GOLD

Aries Electronics

0 -
08-0517-90C

数据表

0517 Bulk Active SIP 8 (1 x 8) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
122-83-320-41-001101

122-83-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
122-83-320-41-001101

数据表

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-422-41-007101

116-87-422-41-007101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
116-87-422-41-007101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 22-HZL/07/7-TT

AR 22-HZL/07/7-TT

SOCKET

Assmann WSW Components

0 -
AR 22-HZL/07/7-TT

数据表

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
110-87-648-41-001101

110-87-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
110-87-648-41-001101

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-648-41-001151

110-87-648-41-001151

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
110-87-648-41-001151

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-83-422-41-001101

612-83-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
612-83-422-41-001101

数据表

612 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-432-31-012101

614-87-432-31-012101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
614-87-432-31-012101

数据表

614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0205-T-2

HLS-0205-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0205-T-2

数据表

HLS Tube Active SIP 10 (2 x 5) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
HLS-0105-G-11

HLS-0105-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0105-G-11

数据表

HLS Tube Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
AR 28-HZL/07/7-TT

AR 28-HZL/07/7-TT

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components

0 -
AR 28-HZL/07/7-TT

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
146-87-322-41-036101

146-87-322-41-036101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
146-87-322-41-036101

数据表

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APH-0902-T-T

APH-0902-T-T

APH-0902-T-T

Samtec Inc.

0 -
APH-0902-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1402-T-T

APH-1402-T-T

APH-1402-T-T

Samtec Inc.

0 -
APH-1402-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1202-T-T

APH-1202-T-T

APH-1202-T-T

Samtec Inc.

0 -
APH-1202-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0802-T-T

APH-0802-T-T

APH-0802-T-T

Samtec Inc.

0 -
APH-0802-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1702-T-T

APH-1702-T-T

APH-1702-T-T

Samtec Inc.

0 -
APH-1702-T-T

数据表

* - Active - - - - - - - - - - - - - - -
08-3518-10E

08-3518-10E

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-3518-10E

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
110-87-632-41-105191

110-87-632-41-105191

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
110-87-632-41-105191

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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