IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
ICA-322-STT

ICA-322-STT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-322-STT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
299-83-310-10-001101

299-83-310-10-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
299-83-310-10-001101

数据表

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-650-41-001101

110-87-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
110-87-650-41-001101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-324-41-008101

116-87-324-41-008101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
116-87-324-41-008101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 40-HZL/07-TT

AR 40-HZL/07-TT

CONN IC DIP SOCKET 40POS GOLD

Assmann WSW Components

0 -
AR 40-HZL/07-TT

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
116-83-624-41-018101

116-83-624-41-018101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
116-83-624-41-018101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 64-HZL/01-TT

AR 64-HZL/01-TT

SOCKET

Assmann WSW Components

0 -
AR 64-HZL/01-TT

数据表

AR Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
ICO-308-ATT

ICO-308-ATT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-308-ATT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
10-2513-10H

10-2513-10H

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-2513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
22-4513-10

22-4513-10

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0 -
22-4513-10

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
116-87-422-41-002101

116-87-422-41-002101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
116-87-422-41-002101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-87-636-41-001101

612-87-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
612-87-636-41-001101

数据表

612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
122-87-424-41-001101

122-87-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
122-87-424-41-001101

数据表

122 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP050-1X31-160B

SIP050-1X31-160B

1X31-160B-SIP SOCKET 31 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X31-160B

数据表

SIP050-1x Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
299-83-310-11-001101

299-83-310-11-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
299-83-310-11-001101

数据表

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APH-1402-T-H

APH-1402-T-H

APH-1402-T-H

Samtec Inc.

0 -
APH-1402-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0502-T-H

APH-0502-T-H

APH-0502-T-H

Samtec Inc.

0 -
APH-0502-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1002-T-H

APH-1002-T-H

APH-1002-T-H

Samtec Inc.

0 -
APH-1002-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0602-T-H

APH-0602-T-H

APH-0602-T-H

Samtec Inc.

0 -
APH-0602-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0202-T-H

APH-0202-T-H

APH-0202-T-H

Samtec Inc.

0 -
APH-0202-T-H

数据表

* - Active - - - - - - - - - - - - - - -
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