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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
510-87-081-09-000101

510-87-081-09-000101

CONN SOCKET PGA 81POS GOLD

Preci-Dip

0 -
510-87-081-09-000101

数据表

510 Bulk Active PGA 81 (9 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-069-11-061101

510-87-069-11-061101

CONN SOCKET PGA 69POS GOLD

Preci-Dip

0 -
510-87-069-11-061101

数据表

510 Bulk Active PGA 69 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
124-83-316-41-002101

124-83-316-41-002101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
124-83-316-41-002101

数据表

124 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-322-41-001101

116-87-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
116-87-322-41-001101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
1571541-2

1571541-2

CONN SOCKET PLCC 52POS TIN

TE Connectivity AMP Connectors

0 -
1571541-2

数据表

PCS Bulk Obsolete PLCC 52 (4 x 13) 0.100" (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Polyphenylene Sulfide (PPS) -
HLS-0113-TT-11

HLS-0113-TT-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0113-TT-11

数据表

HLS Tube Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
110-83-628-41-105101

110-83-628-41-105101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
110-83-628-41-105101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
33-0518-10

33-0518-10

CONN SOCKET SIP 33POS GOLD

Aries Electronics

0 -
33-0518-10

数据表

518 Bulk Active SIP 33 (1 x 33) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
08-0508-20

08-0508-20

CONN SOCKET SIP 8POS GOLD

Aries Electronics

0 -
08-0508-20

数据表

508 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
08-0508-30

08-0508-30

CONN SOCKET SIP 8POS GOLD

Aries Electronics

0 -
08-0508-30

数据表

508 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
08-1508-20

08-1508-20

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-1508-20

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
08-1508-30

08-1508-30

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-1508-30

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
14-C280-10T

14-C280-10T

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

0 -
14-C280-10T

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
146-87-324-41-035101

146-87-324-41-035101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
146-87-324-41-035101

数据表

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-87-324-41-036101

146-87-324-41-036101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
146-87-324-41-036101

数据表

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-320-41-002101

116-83-320-41-002101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
116-83-320-41-002101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-314-NTT

ICO-314-NTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-314-NTT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
HLS-0107-G-2

HLS-0107-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0107-G-2

数据表

HLS Tube Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
ICF-318-TM-O

ICF-318-TM-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-318-TM-O

数据表

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-318-T-I

ICF-318-T-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-318-T-I

数据表

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
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