IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

全部重置
全部应用
结果
图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
ICA-308-WGT

ICA-308-WGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-308-WGT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
510-87-089-12-051101

510-87-089-12-051101

CONN SOCKET PGA 89POS GOLD

Preci-Dip

0 -
510-87-089-12-051101

数据表

510 Bulk Active PGA 89 (12 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
PLCC-052-T-N-TR

PLCC-052-T-N-TR

CONN SOCKET PLCC 52POS TIN

Samtec Inc.

0 -
PLCC-052-T-N-TR

数据表

PLCC Tape & Reel (TR) Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin - Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
116-83-628-41-012101

116-83-628-41-012101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
116-83-628-41-012101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-320-41-011101

116-83-320-41-011101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
116-83-320-41-011101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-100-13-061101

510-87-100-13-061101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

0 -
510-87-100-13-061101

数据表

510 Bulk Active PGA 100 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-100-13-062101

510-87-100-13-062101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

0 -
510-87-100-13-062101

数据表

510 Bulk Active PGA 100 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-100-13-063101

510-87-100-13-063101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

0 -
510-87-100-13-063101

数据表

510 Bulk Active PGA 100 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-100-13-064101

510-87-100-13-064101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

0 -
510-87-100-13-064101

数据表

510 Bulk Active PGA 100 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-636-41-001101

614-83-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
614-83-636-41-001101

数据表

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
18-3513-00

18-3513-00

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-3513-00

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
122-87-432-41-001101

122-87-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
122-87-432-41-001101

数据表

122 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
123-87-432-41-001101

123-87-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
123-87-432-41-001101

数据表

123 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
122-87-628-41-001101

122-87-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
122-87-628-41-001101

数据表

122 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-950-41-005101

110-87-950-41-005101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
110-87-950-41-005101

数据表

110 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-422-41-011101

116-87-422-41-011101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
116-87-422-41-011101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-87-648-41-001101

612-87-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
612-87-648-41-001101

数据表

612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-432-31-012101

614-83-432-31-012101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
614-83-432-31-012101

数据表

614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
17-0518-11H

17-0518-11H

CONN SOCKET SIP 17POS GOLD

Aries Electronics

0 -
17-0518-11H

数据表

518 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
510-87-097-14-091101

510-87-097-14-091101

CONN SOCKET PGA 97POS GOLD

Preci-Dip

0 -
510-87-097-14-091101

数据表

510 Bulk Active PGA 97 (14 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
深圳市宝利科技有限公司

搜索

深圳市宝利科技有限公司

产品

深圳市宝利科技有限公司

电话

深圳市宝利科技有限公司

用户