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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
30-0518-10H

30-0518-10H

CONN SOCKET SIP 30POS GOLD

Aries Electronics

0 -
30-0518-10H

数据表

518 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
30-1518-10H

30-1518-10H

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-1518-10H

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
116-83-628-41-002101

116-83-628-41-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
116-83-628-41-002101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-432-41-001101

116-87-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
116-87-432-41-001101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
123-87-636-41-001101

123-87-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
123-87-636-41-001101

数据表

123 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-648-41-003101

116-87-648-41-003101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
116-87-648-41-003101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-432-41-012101

116-83-432-41-012101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
116-83-432-41-012101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-652-41-001101

614-87-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0 -
614-87-652-41-001101

数据表

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-83-950-41-001101

115-83-950-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
115-83-950-41-001101

数据表

115 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
30-3513-10

30-3513-10

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-3513-10

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICA-318-ZWTT-2

ICA-318-ZWTT-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-318-ZWTT-2

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
122-83-432-41-001101

122-83-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
122-83-432-41-001101

数据表

122 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
123-83-432-41-001101

123-83-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
123-83-432-41-001101

数据表

123 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-83-640-41-001101

612-83-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
612-83-640-41-001101

数据表

612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-320-ZSST

ICA-320-ZSST

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-320-ZSST

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-320-ZSST

ICO-320-ZSST

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-320-ZSST

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
510-83-069-11-001101

510-83-069-11-001101

CONN SOCKET PGA 69POS GOLD

Preci-Dip

0 -
510-83-069-11-001101

数据表

510 Bulk Active PGA 69 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-83-648-41-003101

115-83-648-41-003101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
115-83-648-41-003101

数据表

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
XR2T-1621-N

XR2T-1621-N

CONN IC DIP SOCKET 16POS GOLD

Omron Electronics Inc-EMC Div

0 -
XR2T-1621-N

数据表

XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
214-44-318-01-670799

214-44-318-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

0 -
214-44-318-01-670799

数据表

214 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
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