IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-0304-T-T

APH-0304-T-T

APH-0304-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1204-T-T

APH-1204-T-T

APH-1204-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1304-T-T

APH-1304-T-T

APH-1304-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0704-T-T

APH-0704-T-T

APH-0704-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0404-T-T

APH-0404-T-T

APH-0404-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
HLS-0108-G-12

HLS-0108-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0108-G-12

数据表

HLS Tube Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
10-0511-10

10-0511-10

CONN SOCKET SIP 10POS TIN

Aries Electronics

0 -
10-0511-10

数据表

511 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
614-83-648-41-001101

614-83-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
614-83-648-41-001101

数据表

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0110-G-2

HLS-0110-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0110-G-2

数据表

HLS Tube Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
510-87-133-14-071101

510-87-133-14-071101

CONN SOCKET PGA 133POS GOLD

Preci-Dip

0 -
510-87-133-14-071101

数据表

510 Bulk Active PGA 133 (14 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-628-STT-L

ICA-628-STT-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-628-STT-L

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
299-83-318-10-001101

299-83-318-10-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
299-83-318-10-001101

数据表

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-640-41-007101

116-87-640-41-007101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
116-87-640-41-007101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
123-87-642-41-001101

123-87-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
123-87-642-41-001101

数据表

123 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
22-0513-11

22-0513-11

CONN SOCKET SIP 22POS GOLD

Aries Electronics

0 -
22-0513-11

数据表

0513 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
34-1518-11

34-1518-11

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

0 -
34-1518-11

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICF-632-TL-O-TR

ICF-632-TL-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-632-TL-O-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-632-TL-I-TR

ICF-632-TL-I-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-632-TL-I-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
6-1437536-3

6-1437536-3

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors

0 -
6-1437536-3

数据表

500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass - -55°C ~ 125°C
10-0503-20

10-0503-20

CONN SOCKET SIP 10POS GOLD

Aries Electronics

0 -
10-0503-20

数据表

0503 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
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