IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
510-87-160-13-001101

510-87-160-13-001101

CONN SOCKET PGA 160POS GOLD

Preci-Dip

0 -
510-87-160-13-001101

数据表

510 Bulk Active PGA 160 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-314-LGG

ICO-314-LGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-314-LGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
121-83-642-41-001101

121-83-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
121-83-642-41-001101

数据表

121 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICF-632-F-I-TR

ICF-632-F-I-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-632-F-I-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
146-87-650-41-035101

146-87-650-41-035101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
146-87-650-41-035101

数据表

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-87-650-41-036101

146-87-650-41-036101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
146-87-650-41-036101

数据表

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
24-3513-11

24-3513-11

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-3513-11

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
30-9513-10

30-9513-10

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-9513-10

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICA-318-SGG

ICA-318-SGG

CONN IC DIP SOCKET 18POS GOLD

Samtec Inc.

0 -
ICA-318-SGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-318-SGG

ICO-318-SGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-318-SGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
APA-320-T-A

APA-320-T-A

ADAPTER PLUG

Samtec Inc.

0 -
APA-320-T-A

数据表

APA Bulk Active - 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APO-320-T-A

APO-320-T-A

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-320-T-A

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
ICA-324-ZWTT-2

ICA-324-ZWTT-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-324-ZWTT-2

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
ICA-624-ZWTT-2

ICA-624-ZWTT-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-624-ZWTT-2

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
799288-1

799288-1

CONN IC DIP SOCKET 16POS TINLEAD

TE Connectivity AMP Connectors

0 -
799288-1

数据表

- Box Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin-Lead 3.00µin (0.076µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Tin-Lead 5.00µin (0.127µm) Brass Thermoplastic, Polyester, Glass Filled -
08-2501-21

08-2501-21

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-2501-21

数据表

501 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
08-2501-31

08-2501-31

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-2501-31

数据表

501 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
510-87-156-15-061101

510-87-156-15-061101

CONN SOCKET PGA 156POS GOLD

Preci-Dip

0 -
510-87-156-15-061101

数据表

510 Bulk Active PGA 156 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-156-15-062101

510-87-156-15-062101

CONN SOCKET PGA 156POS GOLD

Preci-Dip

0 -
510-87-156-15-062101

数据表

510 Bulk Active PGA 156 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APH-1406-T-H

APH-1406-T-H

APH-1406-T-H

Samtec Inc.

0 -

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