IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
104-13-304-41-770000

104-13-304-41-770000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-304-41-770000

数据表

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
21-0508-20

21-0508-20

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0 -
21-0508-20

数据表

508 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
605-93-304-11-480000

605-93-304-11-480000

SOCKET CARRIER LOWPRO .300 4POS

Mill-Max Manufacturing Corp.

0 -
605-93-304-11-480000

数据表

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
605-43-304-11-480000

605-43-304-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

0 -
605-43-304-11-480000

数据表

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
16-C280-11H

16-C280-11H

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-C280-11H

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
ICA-314-ZWGG

ICA-314-ZWGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-314-ZWGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
28-3513-11

28-3513-11

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-3513-11

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
24-6518-11H

24-6518-11H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-6518-11H

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
510-83-125-13-041101

510-83-125-13-041101

CONN SOCKET PGA 125POS GOLD

Preci-Dip

0 -
510-83-125-13-041101

数据表

510 Bulk Active PGA 125 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-628-LGT

ICO-628-LGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-628-LGT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
714-43-121-31-018000

714-43-121-31-018000

CONN SOCKET SIP 21POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-121-31-018000

数据表

714 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0508-T-H

APH-0508-T-H

APH-0508-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1908-T-H

APH-1908-T-H

APH-1908-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0608-T-H

APH-0608-T-H

APH-0608-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0908-T-H

APH-0908-T-H

APH-0908-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1408-T-H

APH-1408-T-H

APH-1408-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0708-T-H

APH-0708-T-H

APH-0708-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1208-T-H

APH-1208-T-H

APH-1208-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1808-T-H

APH-1808-T-H

APH-1808-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
28-6518-102

28-6518-102

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-6518-102

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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