IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
12-0508-21

12-0508-21

CONN SOCKET SIP 12POS GOLD

Aries Electronics

0 -
12-0508-21

数据表

508 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
12-0508-31

12-0508-31

CONN SOCKET SIP 12POS GOLD

Aries Electronics

0 -
12-0508-31

数据表

508 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
12-1508-21

12-1508-21

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-1508-21

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
12-1508-31

12-1508-31

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-1508-31

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
HLS-0217-S-22

HLS-0217-S-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0217-S-22

数据表

HLS Tube Active SIP 34 (2 x 17) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
40-6518-11

40-6518-11

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-6518-11

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
510-87-256-16-000101

510-87-256-16-000101

CONN SOCKET PGA 256POS GOLD

Preci-Dip

0 -
510-87-256-16-000101

数据表

510 Bulk Active PGA 256 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-316-JGG

ICO-316-JGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-316-JGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-316-JGG

ICA-316-JGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-316-JGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
HLS-0116-T-32

HLS-0116-T-32

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0116-T-32

数据表

HLS Tube Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
20-6513-11H

20-6513-11H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-6513-11H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
38-0518-11H

38-0518-11H

CONN SOCKET SIP 38POS GOLD

Aries Electronics

0 -
38-0518-11H

数据表

518 Bulk Active SIP 38 (1 x 38) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
38-1518-11H

38-1518-11H

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

0 -
38-1518-11H

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICO-640-SST

ICO-640-SST

CONN IC DIP SOCKET 40POS GOLD

Samtec Inc.

0 -
ICO-640-SST

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-318-AGT

ICA-318-AGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-318-AGT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-318-AGT

ICO-318-AGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-318-AGT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
510-87-243-19-081101

510-87-243-19-081101

CONN SOCKET PGA 243POS GOLD

Preci-Dip

0 -
510-87-243-19-081101

数据表

510 Bulk Active PGA 243 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-225-17-061101

510-87-225-17-061101

CONN SOCKET PGA 225POS GOLD

Preci-Dip

0 -
510-87-225-17-061101

数据表

510 Bulk Active PGA 225 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-223-18-002101

510-87-223-18-002101

CONN SOCKET PGA 223POS GOLD

Preci-Dip

0 -
510-87-223-18-002101

数据表

510 Bulk Active PGA 223 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-223-18-091101

510-87-223-18-091101

CONN SOCKET PGA 223POS GOLD

Preci-Dip

0 -
510-87-223-18-091101

数据表

510 Bulk Active PGA 223 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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