IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
06-3508-21

06-3508-21

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-3508-21

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
ICO-640-NTT

ICO-640-NTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-640-NTT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
510-83-145-13-041101

510-83-145-13-041101

CONN SOCKET PGA 145POS GOLD

Preci-Dip

0 -
510-83-145-13-041101

数据表

510 Bulk Active PGA 145 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APA-320-T-B

APA-320-T-B

ADAPTER PLUG

Samtec Inc.

0 -
APA-320-T-B

数据表

APA Bulk Active - 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APO-320-T-B

APO-320-T-B

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-320-T-B

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
ICO-320-ZCGT

ICO-320-ZCGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-320-ZCGT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
22-4503-20

22-4503-20

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0 -
22-4503-20

数据表

503 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
22-4503-30

22-4503-30

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0 -
22-4503-30

数据表

503 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
APO-422-T-H

APO-422-T-H

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-422-T-H

数据表

APO Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
HLS-0120-T-32

HLS-0120-T-32

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0120-T-32

数据表

HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
510-87-236-17-061101

510-87-236-17-061101

CONN SOCKET PGA 236POS GOLD

Preci-Dip

0 -
510-87-236-17-061101

数据表

510 Bulk Active PGA 236 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
550-80-072-11-061101

550-80-072-11-061101

PGA SOLDER TAIL

Preci-Dip

0 -
550-80-072-11-061101

数据表

550 Bulk Active PGA 72 (11 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
32-6513-10H

32-6513-10H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-6513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICF-624-S-I

ICF-624-S-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-624-S-I

数据表

ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
APH-1604-G-T

APH-1604-G-T

APH-1604-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0204-G-T

APH-0204-G-T

APH-0204-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1204-G-T

APH-1204-G-T

APH-1204-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1304-G-T

APH-1304-G-T

APH-1304-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0304-G-T

APH-0304-G-T

APH-0304-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0704-G-T

APH-0704-G-T

APH-0704-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
深圳市宝利科技有限公司

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