IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
510-83-169-13-000101

510-83-169-13-000101

CONN SOCKET PGA 169POS GOLD

Preci-Dip

0 -
510-83-169-13-000101

数据表

510 Bulk Active PGA 169 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-153-15-061101

510-83-153-15-061101

CONN SOCKET PGA 153POS GOLD

Preci-Dip

0 -
510-83-153-15-061101

数据表

510 Bulk Active PGA 153 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
714-43-127-31-018000

714-43-127-31-018000

CONN SOCKET SIP 27POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-127-31-018000

数据表

714 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0510-T-R

APH-0510-T-R

APH-0510-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1010-T-R

APH-1010-T-R

APH-1010-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0210-T-R

APH-0210-T-R

APH-0210-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1210-T-R

APH-1210-T-R

APH-1210-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0310-T-R

APH-0310-T-R

APH-0310-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
ICA-324-ZWGT-3

ICA-324-ZWGT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-324-ZWGT-3

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
864-AG10D

864-AG10D

CONN IC DIP SOCKET 64POS GOLD

TE Connectivity AMP Connectors

0 -
864-AG10D

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
510-87-280-19-081101

510-87-280-19-081101

CONN SOCKET PGA 280POS GOLD

Preci-Dip

0 -
510-87-280-19-081101

数据表

510 Bulk Active PGA 280 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0116-G-32

HLS-0116-G-32

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0116-G-32

数据表

HLS Tube Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
AW 226-20/G

AW 226-20/G

PIN HEADER

Assmann WSW Components

0 -

-

- Bulk Active - - - - - - - - - - - - - - -
546-83-068-11-061135

546-83-068-11-061135

CONN SOCKET PGA 68POS GOLD

Preci-Dip

0 -
546-83-068-11-061135

数据表

546 Bulk Active PGA 68 (11 x 11) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-83-068-11-061136

546-83-068-11-061136

CONN SOCKET PGA 68POS GOLD

Preci-Dip

0 -
546-83-068-11-061136

数据表

546 Bulk Active PGA 68 (11 x 11) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-169-17-101101

510-83-169-17-101101

CONN SOCKET PGA 169POS GOLD

Preci-Dip

0 -
510-83-169-17-101101

数据表

510 Bulk Active PGA 169 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
20-823-90TWR

20-823-90TWR

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

0 -
20-823-90TWR

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
22-6823-90T

22-6823-90T

CONN IC DIP SOCKET 22POS TIN

Aries Electronics

0 -
22-6823-90T

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
614-87-069-11-061112

614-87-069-11-061112

CONN SOCKET PGA 69POS GOLD

Preci-Dip

0 -
614-87-069-11-061112

数据表

614 Bulk Active PGA 69 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-281-19-081101

510-87-281-19-081101

CONN SOCKET PGA 281POS GOLD

Preci-Dip

0 -
510-87-281-19-081101

数据表

510 Bulk Active PGA 281 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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