IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
ICA-324-ZSGG

ICA-324-ZSGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-324-ZSGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
1437504-3

1437504-3

CONN TRANSIST TO-5 4POS GOLD

TE Connectivity AMP Connectors

0 -

-

8060 Bulk Obsolete Transistor, TO-5 4 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
HLS-0112-G-3

HLS-0112-G-3

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0112-G-3

数据表

HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
20-4518-10E

20-4518-10E

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-4518-10E

数据表

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
12-81250-310C

12-81250-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-81250-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
12-8590-310C

12-8590-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-8590-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
714-43-128-31-018000

714-43-128-31-018000

CONN SOCKET SIP 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-128-31-018000

数据表

714 Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1818-T-H

APH-1818-T-H

APH-1818-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1418-T-H

APH-1418-T-H

APH-1418-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0918-T-H

APH-0918-T-H

APH-0918-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0518-T-H

APH-0518-T-H

APH-0518-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1018-T-H

APH-1018-T-H

APH-1018-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1518-T-H

APH-1518-T-H

APH-1518-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1118-T-H

APH-1118-T-H

APH-1118-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0218-T-H

APH-0218-T-H

APH-0218-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1718-T-H

APH-1718-T-H

APH-1718-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1218-T-H

APH-1218-T-H

APH-1218-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0418-T-H

APH-0418-T-H

APH-0418-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0718-T-H

APH-0718-T-H

APH-0718-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0318-T-H

APH-0318-T-H

APH-0318-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
深圳市宝利科技有限公司

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