IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

全部重置
全部应用
结果
图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
24-6501-21

24-6501-21

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-6501-21

数据表

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
116-43-304-61-006000

116-43-304-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-304-61-006000

116-93-304-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICA-632-ZSGG-L

ICA-632-ZSGG-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-632-ZSGG-L

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
APH-1816-T-R

APH-1816-T-R

APH-1816-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1916-T-R

APH-1916-T-R

APH-1916-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1516-T-R

APH-1516-T-R

APH-1516-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0216-T-R

APH-0216-T-R

APH-0216-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1316-T-R

APH-1316-T-R

APH-1316-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1216-T-R

APH-1216-T-R

APH-1216-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
110-43-310-41-001000

110-43-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-310-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICA-628-ZAGG

ICA-628-ZAGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-628-ZAGG

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-628-ZAGG

ICO-628-ZAGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-628-ZAGG

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
36-6513-11H

36-6513-11H

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0 -
36-6513-11H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
32-0508-20

32-0508-20

CONN SOCKET SIP 32POS GOLD

Aries Electronics

0 -
32-0508-20

数据表

508 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
32-0508-30

32-0508-30

CONN SOCKET SIP 32POS GOLD

Aries Electronics

0 -
32-0508-30

数据表

508 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
32-1508-20

32-1508-20

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-1508-20

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
32-1508-30

32-1508-30

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-1508-30

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
210-99-314-41-001000

210-99-314-41-001000

CONN IC DIP SOCKET 14POS TINLEAD

Mill-Max Manufacturing Corp.

0 -
210-99-314-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-44-314-41-001000

210-44-314-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
210-44-314-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
深圳市宝利科技有限公司

搜索

深圳市宝利科技有限公司

产品

深圳市宝利科技有限公司

电话

深圳市宝利科技有限公司

用户