IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-1122-T-H

APH-1122-T-H

APH-1122-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0222-T-H

APH-0222-T-H

APH-0222-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1722-T-H

APH-1722-T-H

APH-1722-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1222-T-H

APH-1222-T-H

APH-1222-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1622-T-H

APH-1622-T-H

APH-1622-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0722-T-H

APH-0722-T-H

APH-0722-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0322-T-H

APH-0322-T-H

APH-0322-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1322-T-H

APH-1322-T-H

APH-1322-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0822-T-H

APH-0822-T-H

APH-0822-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
ICO-632-ZCGT

ICO-632-ZCGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-632-ZCGT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
28-6511-11

28-6511-11

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-6511-11

数据表

511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
116-47-308-41-006000

116-47-308-41-006000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
116-47-308-41-006000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-41-306-41-008000

116-41-306-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-306-41-008000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-306-41-008000

116-91-306-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-306-41-008000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0211-G-11

HLS-0211-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0211-G-11

数据表

HLS Tube Active SIP 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
828-AG12D

828-AG12D

CONN IC DIP SOCKET 28POS TINLEAD

TE Connectivity AMP Connectors

0 -
828-AG12D

数据表

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin-Lead - Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
24-3503-30

24-3503-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-3503-30

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
22-0503-20

22-0503-20

CONN SOCKET SIP 22POS GOLD

Aries Electronics

0 -
22-0503-20

数据表

0503 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
22-0503-30

22-0503-30

CONN SOCKET SIP 22POS GOLD

Aries Electronics

0 -
22-0503-30

数据表

0503 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
317-91-106-41-005000

317-91-106-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

0 -
317-91-106-41-005000

数据表

317 Bulk Active SIP 6 (1 x 6) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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