IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
614-41-306-31-007000

614-41-306-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-306-31-007000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-306-31-007000

614-91-306-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-306-31-007000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-41-306-31-012000

614-41-306-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-306-31-012000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-306-31-012000

614-91-306-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-306-31-012000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
146-41-308-41-013000

146-41-308-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.

0 -
146-41-308-41-013000

数据表

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
146-91-308-41-013000

146-91-308-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.

0 -
146-91-308-41-013000

数据表

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1814-T-T

APH-1814-T-T

APH-1814-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1914-T-T

APH-1914-T-T

APH-1914-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1514-T-T

APH-1514-T-T

APH-1514-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1014-T-T

APH-1014-T-T

APH-1014-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0614-T-T

APH-0614-T-T

APH-0614-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1114-T-T

APH-1114-T-T

APH-1114-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0214-T-T

APH-0214-T-T

APH-0214-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1614-T-T

APH-1614-T-T

APH-1614-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
126-41-306-41-001000

126-41-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-306-41-001000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-306-41-001000

126-91-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-306-41-001000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0310-G-2

HLS-0310-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0310-G-2

数据表

HLS Tube Active SIP 30 (3 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
18-3508-202

18-3508-202

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-3508-202

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
HLS-0212-G-38

HLS-0212-G-38

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0212-G-38

数据表

HLS Tube Active SIP 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
614-41-306-31-002000

614-41-306-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-306-31-002000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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