IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-1124-T-T

APH-1124-T-T

APH-1124-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1324-T-T

APH-1324-T-T

APH-1324-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0724-T-T

APH-0724-T-T

APH-0724-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1624-T-T

APH-1624-T-T

APH-1624-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1824-T-T

APH-1824-T-T

APH-1824-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
614-93-306-31-018000

614-93-306-31-018000

SOCKET CARRIER LOWPRO .300 6POS

Mill-Max Manufacturing Corp.

0 -
614-93-306-31-018000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-306-31-018000

614-43-306-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-306-31-018000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
21-7438-10

21-7438-10

CONN SOCKET SIP 21POS TIN

Aries Electronics

0 -
21-7438-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
21-7530-10

21-7530-10

CONN SOCKET SIP 21POS TIN

Aries Electronics

0 -
21-7530-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
21-7562-10

21-7562-10

CONN SOCKET SIP 21POS TIN

Aries Electronics

0 -
21-7562-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
22-6823-90

22-6823-90

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0 -
22-6823-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
26-6823-90T

26-6823-90T

CONN IC DIP SOCKET 26POS TIN

Aries Electronics

0 -
26-6823-90T

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
346-93-146-41-013000

346-93-146-41-013000

CONN SOCKET SIP 46POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-93-146-41-013000

数据表

346 Bulk Active SIP 46 (1 x 46) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-43-146-41-013000

346-43-146-41-013000

CONN SOCKET SIP 46POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-43-146-41-013000

数据表

346 Bulk Active SIP 46 (1 x 46) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICF-322-STL-O

ICF-322-STL-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-322-STL-O

数据表

ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
36-3513-10H

36-3513-10H

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0 -
36-3513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
24-3570-10

24-3570-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0 -
24-3570-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
24-6570-10

24-6570-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0 -
24-6570-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
116-41-310-41-007000

116-41-310-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-310-41-007000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-310-41-007000

116-91-310-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-310-41-007000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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