IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APA-422-G-A1

APA-422-G-A1

ADAPTER PLUG

Samtec Inc.

0 -
APA-422-G-A1

数据表

APA Bulk Active - 22 (2 x 11) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APO-422-G-A1

APO-422-G-A1

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-422-G-A1

数据表

APO Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APH-0510-G-T

APH-0510-G-T

APH-0510-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0610-G-T

APH-0610-G-T

APH-0610-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1710-G-T

APH-1710-G-T

APH-1710-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1210-G-T

APH-1210-G-T

APH-1210-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0410-G-T

APH-0410-G-T

APH-0410-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0310-G-T

APH-0310-G-T

APH-0310-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1410-G-T

APH-1410-G-T

APH-1410-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
104-11-310-41-770000

104-11-310-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
104-11-310-41-770000

数据表

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-41-210-41-007000

116-41-210-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-210-41-007000

数据表

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-210-41-007000

116-91-210-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-210-41-007000

数据表

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
24-3575-10

24-3575-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0 -
24-3575-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
24-6575-10

24-6575-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0 -
24-6575-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
210-41-322-41-001000

210-41-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-41-322-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-41-422-41-001000

210-41-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-41-422-41-001000

数据表

210 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-91-322-41-001000

210-91-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-91-322-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-91-422-41-001000

210-91-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-91-422-41-001000

数据表

210 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-93-147-41-013000

346-93-147-41-013000

CONN SOCKET SIP 47POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-93-147-41-013000

数据表

346 Bulk Active SIP 47 (1 x 47) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-43-147-41-013000

346-43-147-41-013000

CONN SOCKET SIP 47POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-43-147-41-013000

数据表

346 Bulk Active SIP 47 (1 x 47) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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