IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
116-43-310-41-007000

116-43-310-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-310-41-007000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
605-41-310-11-480000

605-41-310-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

0 -
605-41-310-11-480000

数据表

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
605-91-310-11-480000

605-91-310-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

0 -
605-91-310-11-480000

数据表

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-41-316-41-105000

110-41-316-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-41-316-41-105000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-91-316-41-105000

110-91-316-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-91-316-41-105000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
80-PGM12015-10

80-PGM12015-10

CONN SOCKET PGA GOLD

Aries Electronics

0 -
80-PGM12015-10

数据表

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
APH-0524-T-H

APH-0524-T-H

APH-0524-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0924-T-H

APH-0924-T-H

APH-0924-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1924-T-H

APH-1924-T-H

APH-1924-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1424-T-H

APH-1424-T-H

APH-1424-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1524-T-H

APH-1524-T-H

APH-1524-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1124-T-H

APH-1124-T-H

APH-1124-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1324-T-H

APH-1324-T-H

APH-1324-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0324-T-H

APH-0324-T-H

APH-0324-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0224-T-H

APH-0224-T-H

APH-0224-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1624-T-H

APH-1624-T-H

APH-1624-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0424-T-H

APH-0424-T-H

APH-0424-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
1-1437508-3

1-1437508-3

CONN TRANSIST TO-5 8POS GOLD

TE Connectivity AMP Connectors

0 -
1-1437508-3

数据表

8058 Bulk Obsolete Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
116-83-650-41-004101

116-83-650-41-004101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
116-83-650-41-004101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
23-7400-10

23-7400-10

CONN SOCKET SIP 23POS TIN

Aries Electronics

0 -
23-7400-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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