IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

全部重置
全部应用
结果
图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
114-47-324-41-117000

114-47-324-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
114-47-324-41-117000

数据表

114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-47-424-41-117000

114-47-424-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
114-47-424-41-117000

数据表

114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-47-624-41-117000

114-47-624-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
114-47-624-41-117000

数据表

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
104-13-310-41-770000

104-13-310-41-770000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-310-41-770000

数据表

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
60-9513-11

60-9513-11

CONN IC DIP SOCKET 60POS GOLD

Aries Electronics

0 -
60-9513-11

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 60 (2 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
116-93-308-41-008000

116-93-308-41-008000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-308-41-008000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-308-41-008000

116-43-308-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-308-41-008000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-210-41-007000

116-93-210-41-007000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-210-41-007000

数据表

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-210-41-007000

116-43-210-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-210-41-007000

数据表

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-41-308-31-012000

614-41-308-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-308-31-012000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-308-31-012000

614-91-308-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-308-31-012000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
14-0501-31

14-0501-31

CONN SOCKET SIP 14POS GOLD

Aries Electronics

0 -
14-0501-31

数据表

501 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
346-93-149-41-013000

346-93-149-41-013000

CONN SOCKET SIP 49POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-93-149-41-013000

数据表

346 Bulk Active SIP 49 (1 x 49) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-43-149-41-013000

346-43-149-41-013000

CONN SOCKET SIP 49POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-43-149-41-013000

数据表

346 Bulk Active SIP 49 (1 x 49) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
146-41-314-41-012000

146-41-314-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

0 -
146-41-314-41-012000

数据表

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
146-91-314-41-012000

146-91-314-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

0 -
146-91-314-41-012000

数据表

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-304-61-001000

116-43-304-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-304-61-001000

116-93-304-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-41-308-31-002000

614-41-308-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-308-31-002000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-308-31-002000

614-91-308-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-308-31-002000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
深圳市宝利科技有限公司

搜索

深圳市宝利科技有限公司

产品

深圳市宝利科技有限公司

电话

深圳市宝利科技有限公司

用户