IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
614-93-310-31-007000

614-93-310-31-007000

SOCKET CARRIER LOWPRO .300 10POS

Mill-Max Manufacturing Corp.

0 -
614-93-310-31-007000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-41-210-41-001000

123-41-210-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
123-41-210-41-001000

数据表

123 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-310-31-007000

614-43-310-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-310-31-007000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
32-3551-10

32-3551-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

0 -
32-3551-10

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
32-3552-10

32-3552-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

0 -
32-3552-10

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
32-3553-10

32-3553-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

0 -
32-3553-10

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
32-6552-10

32-6552-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

0 -
32-6552-10

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
32-6553-10

32-6553-10

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

0 -
32-6553-10

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
317-91-114-41-005000

317-91-114-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

0 -
317-91-114-41-005000

数据表

317 Bulk Active SIP 14 (1 x 14) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-41-310-41-002000

126-41-310-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-310-41-002000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-310-41-002000

126-91-310-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-310-41-002000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0607-T-2-L

HLS-0607-T-2-L

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0607-T-2-L

数据表

HLS Bulk Active SIP 42 (6 x 7) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
APH-0524-T-R

APH-0524-T-R

APH-0524-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0920-T-T

APH-0920-T-T

APH-0920-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0924-T-R

APH-0924-T-R

APH-0924-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1424-T-R

APH-1424-T-R

APH-1424-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1520-T-T

APH-1520-T-T

APH-1520-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0624-T-R

APH-0624-T-R

APH-0624-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0220-T-T

APH-0220-T-T

APH-0220-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0324-T-R

APH-0324-T-R

APH-0324-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
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