IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
28-3508-302

28-3508-302

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-3508-302

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-6508-202

28-6508-202

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-6508-202

数据表

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-6508-302

28-6508-302

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-6508-302

数据表

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
68-PGM11032-10H

68-PGM11032-10H

CONN SOCKET PGA GOLD

Aries Electronics

0 -
68-PGM11032-10H

数据表

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
110-43-320-41-605000

110-43-320-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-320-41-605000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICA-640-ZWGT-3

ICA-640-ZWGT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-640-ZWGT-3

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
317-47-117-41-005000

317-47-117-41-005000

STANDRD SOLDRTL SNG SKT

Mill-Max Manufacturing Corp.

0 -
317-47-117-41-005000

数据表

317 Bulk Active SIP 17 (1 x 17) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-47-620-41-005000

117-47-620-41-005000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
117-47-620-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0510-G-R

APH-0510-G-R

APH-0510-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1510-G-R

APH-1510-G-R

APH-1510-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0610-G-R

APH-0610-G-R

APH-0610-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1910-G-R

APH-1910-G-R

APH-1910-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1110-G-R

APH-1110-G-R

APH-1110-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0810-G-R

APH-0810-G-R

APH-0810-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0310-G-R

APH-0310-G-R

APH-0310-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0710-G-R

APH-0710-G-R

APH-0710-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1210-G-R

APH-1210-G-R

APH-1210-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
210-41-632-41-001000

210-41-632-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-41-632-41-001000

数据表

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-91-632-41-001000

210-91-632-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-91-632-41-001000

数据表

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICA-628-WGG-2

ICA-628-WGG-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-628-WGG-2

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
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