IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
110-93-420-41-105000

110-93-420-41-105000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-93-420-41-105000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-420-41-105000

110-43-420-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-420-41-105000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-83-225-18-019101

510-83-225-18-019101

CONN SOCKET PGA 225POS GOLD

Preci-Dip

0 -
510-83-225-18-019101

数据表

510 Bulk Active PGA 225 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-91-422-41-003000

115-91-422-41-003000

SOCKET IC OPEN LOWPRO .400 22POS

Mill-Max Manufacturing Corp.

0 -

-

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Thermoplastic -55°C ~ 125°C
115-41-422-41-003000

115-41-422-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-41-422-41-003000

数据表

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0114-G-3

HLS-0114-G-3

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0114-G-3

数据表

HLS Tube Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
21-0501-21

21-0501-21

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0 -
21-0501-21

数据表

501 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
21-0501-31

21-0501-31

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0 -
21-0501-31

数据表

501 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
50-9513-10H

50-9513-10H

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

0 -
50-9513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
110-93-318-41-105000

110-93-318-41-105000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-93-318-41-105000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1416-T-T

APH-1416-T-T

APH-1416-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0916-T-T

APH-0916-T-T

APH-0916-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0516-T-T

APH-0516-T-T

APH-0516-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1016-T-T

APH-1016-T-T

APH-1016-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1116-T-T

APH-1116-T-T

APH-1116-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0316-T-T

APH-0316-T-T

APH-0316-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1716-T-T

APH-1716-T-T

APH-1716-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
28-3503-20

28-3503-20

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-3503-20

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
58-1518-00

58-1518-00

CONN IC DIP SOCKET 58POS GOLD

Aries Electronics

0 -
58-1518-00

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 58 (2 x 29) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
18-81125-610C

18-81125-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-81125-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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