IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
110-43-422-41-105000

110-43-422-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-422-41-105000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-43-308-41-004000

612-43-308-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-43-308-41-004000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-93-308-41-004000

612-93-308-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-93-308-41-004000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-91-640-41-001000

110-91-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-91-640-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-11-308-41-001000

612-11-308-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-11-308-41-001000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
104-13-210-41-780000

104-13-210-41-780000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-210-41-780000

数据表

104 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
614-41-314-31-002000

614-41-314-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-314-31-002000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-314-31-002000

614-91-314-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-314-31-002000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APO-322-T-C

APO-322-T-C

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1320-T-R

APH-1320-T-R

APH-1320-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1720-T-R

APH-1720-T-R

APH-1720-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1220-T-R

APH-1220-T-R

APH-1220-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0720-T-R

APH-0720-T-R

APH-0720-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
34-7335-10

34-7335-10

CONN SOCKET SIP 34POS TIN

Aries Electronics

0 -
34-7335-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
34-7350-10

34-7350-10

CONN SOCKET SIP 34POS TIN

Aries Electronics

0 -
34-7350-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
34-7394-10

34-7394-10

CONN SOCKET SIP 34POS TIN

Aries Electronics

0 -
34-7394-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
34-7400-10

34-7400-10

CONN SOCKET SIP 34POS TIN

Aries Electronics

0 -
34-7400-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
34-7435-10

34-7435-10

CONN SOCKET SIP 34POS TIN

Aries Electronics

0 -
34-7435-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
34-7450-10

34-7450-10

CONN SOCKET SIP 34POS TIN

Aries Electronics

0 -
34-7450-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
34-7453-10

34-7453-10

CONN SOCKET SIP 34POS TIN

Aries Electronics

0 -
34-7453-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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